editor's blog
Subscribe Now

Another 3 from Springsoft

On the heels of their Verdi3 announcement, Springsoft continues its triplication, now with Laker3. They position Laker as the “best established interoperable custom design flow.” As with all carefully-crafted positioning statements, the key qualifier they use here is “interoperable.” This refers both to the fact that they use the OpenAccess database and to their ability to integrate with Mentor’s RealTime engine for on-the-fly Calibre checks.

Part of the upgrade deals with the usual performance and GUI enhancements. They’ve paid particular attention to file I/O, which is a significant bottleneck, and drawing speed; they improved the former by 2-10X and the latter by as much as 6X.

They’re also targeting the more aggressive geometries, with support for double-patterning in their new, unified DRC engine that supports automatic place-and-route (but not sign-off DRC).

But the newer and more different addition they’re touting is their analog prototyping tool. It will take circuits and automatically detect patterns to generate layout constraints. Those constraints can be manually edited and iterated until place and route gives the desired result. We actually saw something like this with Cadence’s Circuit Prospector before; Springsoft claims that theirs is a much more automatic process, with Cadence’s solution requiring SKIL programming.

You can find more in their latest release

Leave a Reply

featured blogs
Jun 2, 2023
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....
Jun 2, 2023
Explore the importance of big data analytics in the semiconductor manufacturing process, as chip designers pull insights from throughout the silicon lifecycle. The post Demanding Chip Complexity and Manufacturing Requirements Call for Data Analytics appeared first on New Hor...

featured video

The Role of Artificial Intelligence and Machine Learning in Electronic Design

Sponsored by Cadence Design Systems

In this video, we talk to Paul Cunningham, Senior VP and GM at Cadence, about the transformative role of artificial intelligence and machine learning (AI/ML) in electronic designs. We discuss the transformative period we are experiencing with AI and ML and how Cadence is revolutionizing how we design and verify chips through “computationalizing intuition” and building intuitive systems that learn and adapt to the world around them. With human lives at stake, reliability, and safety are paramount.

Learn More

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

Bluetooth LE Audio
Bluetooth LE Audio is a prominent component in audio innovation today. In this episode of Chalk Talk, Finn Boetius from Nordic Semiconductor and Amelia Dalton discuss the what, where, and how of Bluetooth LE audio. They take a closer look at Bluetooth LE audio profiles, the architecture of Bluetooth LE audio and how you can get started using Bluetooth LE audio in your next design.
Jan 3, 2023
20,724 views