editor's blog
Subscribe Now

Exploiting the IoT

There’s technology and then there’s marketing. Properly done, they work well together. But there are times when the marketing gets ahead of the technology and times when it can actually be behind the technology. In both cases, it can be intentional or inadvertent.

We’ve talked about the META processor from Imagination Technologies (IMG), both generically and with respect to its threading capabilities. Still, IMG have intentionally focused their messaging on the larger functions that include a processor; they have done little to specifically promote the META brand on its own. In this regard, the META marketing has remained in the shadows even as the technology itself was given their full attention.

In a conversation with them at ESC, they noted that this will change. They see an opportunity to make specific processor inroads using the technology that they’ve been honing for years. You might think it’s foolhardy to jump in against the likes of ARM or MIPS at this juncture, and IMG would agree. There’s little stomach for going head-to-head against these guys in their well-entrenched markets, defended by giant, impenetrable walls built out of millions of lines of legacy code.

Instead, they see the Internet of Things (IoT) as their ticket. This is a fresh domain, meaning that there’s not a lot of existing code in place. It requires smaller processors, making those a natural focus. They have processors that can work at the application level, but competing at that level takes them head-to-head with the big incumbents, so they’re laying a bit low on such devices until, perhaps, they have carved more space out for themselves within their more accessible target region.

Of course, the IoT needs more than processors, and IMG is also putting forward the supporting IP necessary to complete a solution. Services like FlowWorld also contribute to the overall picture.

You can see more about what they have to say on the matter in their recent news release.

Leave a Reply

featured blogs
Oct 23, 2020
The Covid-19 pandemic continues to impact our lives in both expected and unexpected ways. Unfortunately, one of the expected ways is a drop in charitable donations. Analysts predict anywhere from a 6% decrease '€“ with many planning for a bigger decline than that. Also, mor...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...
Oct 23, 2020
At 11:10am Korean time this morning, Cadence's Elias Fallon delivered one of the keynotes at ISOCC (International System On Chip Conference). It was titled EDA and Machine Learning: The Next Leap... [[ Click on the title to access the full blog on the Cadence Community ...

featured video

Demo: Inuitive NU4000 SoC with ARC EV Processor Running SLAM and CNN

Sponsored by Synopsys

See Inuitive’s NU4000 3D imaging and vision processor in action. The SoC supports high-quality 3D depth processor engine, SLAM accelerators, computer vision, and deep learning by integrating Synopsys ARC EV processor. In this demo, the NU4000 demonstrates simultaneous 3D sensing, SLAM and CNN functionality by mapping out its environment and localizing the sensor while identifying the objects within it. For more information, visit inuitive-tech.com.

Click here for more information about DesignWare ARC EV Processors for Embedded Vision

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

Rail Data Connectivity

Sponsored by Mouser Electronics and TE Connectivity

The rail industry is undergoing a technological revolution right now, and Ethernet connectivity is at the heart of it. But, finding the right interconnect solutions for high-reliability applications such as rail isn’t easy. In this episode of Chalk Talk, Amelia Dalton chats with Egbert Stellinga from TE Connectivity about TE’s portfolio of interconnect solutions for rail and other reliability-critical applications.

Click here for more information about TE Connectivity EN50155 Managed Ethernet Switches