editor's blog
Subscribe Now

3D IC Design Suite

There’s lots of talk about 3D (and 2-1/2-D) ICs, with through-silicon vias (TSVs) being a key enabling technology. The possibilities are exciting, but the reality also appears to be challenging. Costs are high, there are still reliability questions to answer, and the overall design flow has yet to be thoroughly established. Even just simple questions like place and route have been the subject of early projects (involving at least one company that’s no longer in business).

Synopsys has recently announced their 3D-IC Initiative, essentially a collection of their EDA tools focused on hacking a flow through this technology jungle. It includes digital and custom design support, test, parasitic extraction, memory compilation, simulation, and more. All of which are impacted by 3D IC design.

Even though you might wonder, “How hard can it be to stack one die on top of another?” the answer appears to be, “Pretty hard.” At least until the tools settle down to make it easier.

More details in their release

Leave a Reply

featured blogs
Jul 11, 2025
Can you help me track down the source of the poem titled 'The African Tigger is Fading Away'?...

Libby's Lab

Libby's Lab - Scopes out Littelfuse C&K Aerospace AeroSplice Connectors

Sponsored by Mouser Electronics and Littelfuse

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the Littelfuse C&K Aerospace Aerosplice Connectors, available at Mouser.com! These connectors are ideal for high-reliability easy-to-use wire-to-wire connections in aerospace applications. Keep your circuits charged and your ideas sparking!

Click here for more information

featured paper

AI-based Defect Detection System that is Both High Performance and Highly Accurate Implemented in Low-cost, Low-power FPGAs

Sponsored by Altera

Learn how MAX® 10 FPGAs enable real-time, high-accuracy AI-based defect detection at the industrial edge without a GPU. This white paper explores a production-proven solution that delivers 24× higher accuracy, 488× lower latency, and 20× lower power than traditional approaches, with a compact footprint ideal for embedded vision systems.

Click to read more

featured chalk talk

Power Modules and Why You Should Use Them in Your Next Power Design
In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.
Aug 22, 2024
43,297 views