editor's blog
Subscribe Now

FIRST Follow-up

On Monday we talked about the Seattle-area FIRST robotics team from Liberty High School in the Issaquah district. We now have some video of their robot in action. You can see it both delivering and retrieving basketballs, and at the end, they attempt to balance on the ramp. Will they make it?

Bear in mind, this was a rookie team. They also shared with me (in the spirit of coopetition) a video of one of the final matches.

Nothing but net…

(Well, almost…)

Leave a Reply

featured blogs
Dec 7, 2023
Semiconductor chips must be designed faster, smaller, and smarter'”with less manual work, more automation, and faster production. The Training Webinar 'Flow Wrapping: The Cadence Cerebrus Intelligent Chip Explorer Must Have' was recently hosted with me, Krishna Atreya, Princ...
Dec 6, 2023
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Advantech Edge Gateways for Equipment Monitoring
Sponsored by Mouser Electronics and Advantech
One of the biggest challenges with equipment monitoring today includes one critical question: How do I integrate multiple data formats from different devices, equipment, meters, and sensors into my system? In this episode of Chalk Talk, Amelia Dalton chats with Eric Wang from Advantech about how the Advantech WISE-EdgeLink solution can help you navigate the challenges of data collection in edge applications. They also take a closer look at the benefits of the Advantech WISE-EdgeLink smart gateway family and show you how to get started using one of these smart gateways in your next edge application. 
Mar 1, 2023
32,539 views