In some countries the cell phone carrier and the land line carrier is the same company. And it is these guys who are working hard with the femtocell people, particularly as most smart phone users do the heavy downloads, such as software upgrades and adding new apps etc, at home.
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 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
