editor's blog
Subscribe Now

Establishing 3D IC Standards – Or Not

For those of you watching 3D IC advancements, there’s a discussion you might want to come join next week at DesignCon in Santa Clara. Bill Bayer and Sumit DasGupta of Si2 have assembled a panel from Qualcomm, Sematech, Si2, and Xilinx, plus Jim Hogan, to discuss what, if anything, needs to be standardized in the 3D IC world in order to help it build a head of steam.

Standards cut both ways. Done well, they reduce chaos and help provide some direction for market participants. This makes folks less cautious about adopting and driving the technology. Too many standards, or the wrong ones, however, and you block the opportunity to do something better because you’ve locked in an old idea as a standard.

And it’s not always easy to find your way through the maze of things that could be standardized, especially once a standards body gets ahold of it. I remember years ago at JEDEC trying to set I/O standards. This was important so that different chips could talk to each other. But those I/O standards are on the datasheet – and the committee just couldn’t stop there and had to start standardizing practically the whole dang datasheet, even though interchange was no longer the issue (and no one had complained about the rest of the datasheet).

Anyway, here’s your opportunity to weigh in. I’ll be seeding the discussion with questions on the off chance that these guys need any prodding. And we’ll also be encouraging audience questions, so come make yourselves heard. We’re on at 3:45 on January 31st. Hope to see you.

More details in the announcement

Leave a Reply

featured blogs
Dec 1, 2020
If you'€™d asked me at the beginning of 2020 as to the chances of my replicating an 1820 Welsh dresser, I would have said '€œzero,'€ which just goes to show how little I know....
Dec 1, 2020
More package designers these days, with the increasing component counts and more complicated electrical constraints, are shifting to using a front-end schematic capture tool. As with IC and PCB... [[ Click on the title to access the full blog on the Cadence Community site. ]...
Dec 1, 2020
UCLA’s Maxx Tepper gives us a brief overview of the Ocean High-Throughput processor to be used in the upgrade of the real-time event selection system of the CMS experiment at the CERN LHC (Large Hadron Collider). The board incorporates Samtec FireFly'„¢ optical cable ...
Nov 25, 2020
[From the last episode: We looked at what it takes to generate data that can be used to train machine-learning .] We take a break from learning how IoT technology works for one of our occasional posts on how IoT technology is used. In this case, we look at trucking fleet mana...

featured video

Accelerate Automotive Certification with Synopsys Functional Safety Test Solution

Sponsored by Synopsys

With the Synopsys Functional Safety Test Solution architecture, designers of automotive SoCs can integrate an automated, end-to-end BIST solution to accelerate ISO compliance and time-to-market.

Click here for more information about Embedded Test & Repair

featured paper

Exploring advancements in industrial and automotive markets with 60-GHz radar

Sponsored by Texas Instruments

The industrial and automotive markets have a tremendous need for innovative sensing technologies to help buildings, cities and automobiles sense the world around them and make more intelligent decisions.

Click here to read the article

featured chalk talk

The Wireless Member of the DARWIN Family

Sponsored by Mouser Electronics and Maxim Integrated

MCUs continue to evolve based on increasing demands from designers. We expect our microcontrollers to do more than ever - better security, more performance, lower power consumption - and we want it all for less money, of course. In this episode of Chalk Talk, Amelia Dalton chats with Kris Ardis from Maxim Integrated about the new DARWIN line of low-power MCUs.

Click here for more information about Maxim Integrated MAX32665-MAX32668 UB Class Microcontroller