editor's blog
Subscribe Now

Establishing 3D IC Standards – Or Not

For those of you watching 3D IC advancements, there’s a discussion you might want to come join next week at DesignCon in Santa Clara. Bill Bayer and Sumit DasGupta of Si2 have assembled a panel from Qualcomm, Sematech, Si2, and Xilinx, plus Jim Hogan, to discuss what, if anything, needs to be standardized in the 3D IC world in order to help it build a head of steam.

Standards cut both ways. Done well, they reduce chaos and help provide some direction for market participants. This makes folks less cautious about adopting and driving the technology. Too many standards, or the wrong ones, however, and you block the opportunity to do something better because you’ve locked in an old idea as a standard.

And it’s not always easy to find your way through the maze of things that could be standardized, especially once a standards body gets ahold of it. I remember years ago at JEDEC trying to set I/O standards. This was important so that different chips could talk to each other. But those I/O standards are on the datasheet – and the committee just couldn’t stop there and had to start standardizing practically the whole dang datasheet, even though interchange was no longer the issue (and no one had complained about the rest of the datasheet).

Anyway, here’s your opportunity to weigh in. I’ll be seeding the discussion with questions on the off chance that these guys need any prodding. And we’ll also be encouraging audience questions, so come make yourselves heard. We’re on at 3:45 on January 31st. Hope to see you.

More details in the announcement

Leave a Reply

featured blogs
Jul 1, 2022
We all look for 100% perfection and want to turn our dreams (expectations) into reality as far as we can. Are you also looking for a magic wand to turn expectation into reality? The story applies to... ...
Jun 30, 2022
Learn how AI-powered cameras and neural network image processing enable everything from smartphone portraits to machine vision and automotive safety features. The post How AI Helps Cameras See More Clearly appeared first on From Silicon To Software....
Jun 28, 2022
Watching this video caused me to wander off into the weeds looking at a weird and wonderful collection of wheeled implementations....

featured video

Synopsys 112G Ethernet IP Interoperating with Optical Components & Equalizing E-O-E Link

Sponsored by Synopsys

This OFC 2022 demo features the Synopsys 112G Ethernet IP directly equalizing electrical-optical-electrical (E-O-E) channel and supporting retimer-free CEI-112G linear drive for low-power applications.

Learn More

featured paper

Addressing high-voltage design challenges with reliable and affordable isolation tech

Sponsored by Texas Instruments

Check out TI’s new white paper for an overview of galvanic isolation techniques, as well as how to improve isolated designs in electric vehicles, grid infrastructure, factory automation and motor drives.

Click to read more

featured chalk talk

Clamping Down on Failure: Protecting 24 V Digital Outputs

Sponsored by Mouser Electronics and Skyworks

If you're designing IEC61131 compliant digital outputs for these PLCs or industrial controllers, you need to have a plan to protect these outputs from a variety of unknowns. In this episode of Chalk Talk, Amelia Dalton chats with Asa Kirby from Skyworks about an innovative new isolated smart switch device from Skyworks that gives you an unprecedented level of channel flexibility and protection, letting you offer customers a truly “set it and forget it” solution when it comes to your next PLC design.

Click here for more information about Skyworks Solutions Inc. Si834x Isolated Smart Switches