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Steve is one of the few people w

Steve is one of the few people who has ever convinced hard-nosed engineers that design is not an optional extra, but integral to how well a product performs and sells. Without his vision the world would have even more bland boxes and ho-hum interfaces.

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featured blogs
Nov 23, 2022
The current challenge in custom/mixed-signal design is to have a fast and silicon-accurate methodology. In this blog series, we are exploring the Custom IC Design Flow and Methodology stages. This methodology directly addresses the primary challenge of predictability in creat...
Nov 22, 2022
Learn how analog and mixed-signal (AMS) verification technology, which we developed as part of DARPA's POSH and ERI programs, emulates analog designs. The post What's Driving the World's First Analog and Mixed-Signal Emulation Technology? appeared first on From Silicon To So...
Nov 21, 2022
By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize… ...
Nov 18, 2022
This bodacious beauty is better equipped than my car, with 360-degree collision avoidance sensors, party lights, and a backup camera, to name but a few....

featured video

How to Harness the Massive Amounts of Design Data Generated with Every Project

Sponsored by Cadence Design Systems

Long gone are the days where engineers imported text-based reports into spreadsheets and sorted the columns to extract useful information. Introducing the Cadence Joint Enterprise Data and AI (JedAI) platform created from the ground up for EDA data such as waveforms, workflows, RTL netlists, and more. Using Cadence JedAI, engineering teams can visualize the data and trends and implement practical design strategies across the entire SoC design for improved productivity and quality of results.

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featured paper

How SHP in plastic packaging addresses 3 key space application design challenges

Sponsored by Texas Instruments

TI’s SHP space-qualification level provides higher thermal efficiency, a smaller footprint and increased bandwidth compared to traditional ceramic packaging. The common package and pinout between the industrial- and space-grade versions enable you to get the newest technologies into your space hardware designs as soon as the commercial-grade device is sampling, because all prototyping work on the commercial product translates directly to a drop-in space-qualified SHP product.

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featured chalk talk

Industrial Ethernet Next Generation Connections

Sponsored by Mouser Electronics and Amphenol ICC

No longer are hierarchical communication models effective in this new era of Industry 4.0. We need to look at an independent communication model that includes a single network with industrial ethernet at its core. In this episode of Chalk Talk, Amelia Dalton chats with Peter Swift about Amphenol’s SPE and iX Industrial family of connectors. They take a closer look at the details of these connector solutions and investigate why they are a great fit for the next generation of industrial automation applications.

Click here for more information about Amphenol ICC Industrial Ethernet Connectors & Cable Assemblies