I wonder if there are heat issues with stacking memory die like that?
September 23, 2011
featured blogs
Sep 28, 2023
See how we set (and meet) our GHG emission reduction goals with the help of the Science Based Targets initiative (SBTi) as we expand our sustainable energy use.The post Synopsys Smart Future: Our Climate Actions to Reduce Greenhouse Gas Emissions appeared first on Chip Des...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....
featured paper
 Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated PaceSponsored by Intel We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h |
featured chalk talk
One Year of Synopsys Cloud: Adoption, Enhancements and Evolution
Sponsored by Synopsys
The adoption of the cloud in the design automation industry has encouraged innovation across the entire semiconductor lifecycle. In this episode of Chalk Talk, Amelia Dalton chats with Vikram Bhatia from Synopsys about how Synopsys is redefining EDA in the Cloud with the industry’s first complete browser-based EDA-as-a-Service cloud platform. They explore the benefits that this on-demand pay-per use, web-based portal can bring to your next design.