I wonder if there are heat issues with stacking memory die like that?
September 23, 2011
featured blogs
Oct 3, 2024
Someone with too much time on his hands managed to get Linux to boot on an Intel 4004 in only 4.76 days...
featured paper
 A game-changer for IP designers: design-stage verificationSponsored by Siemens Digital Industries Software In this new technical paper, you’ll gain valuable insights into how, by moving physical verification earlier in the IP design flow, you can locate and correct design errors sooner, reducing costs and getting complex designs to market faster. Dive into the challenges of hard, soft and custom IP creation, and learn how to run targeted, real-time or on-demand physical verification with precision, earlier in the layout process. |
featured chalk talk
SiC-Based High-Density Industrial Charger Solutions
Sponsored by Mouser Electronics and onsemi
In this episode of Chalk Talk, Amelia Dalton and Prasad Paruchuri from onsemi explore the benefits of silicon carbide based high density industrial charging solutions. They investigate the topologies of Totem Pole PFC and Half Bridge LLC circuits, the challenges that bidirectional CLLC resonant DC-DC converters are solving today, and how you can take advantage of onsemi’s silicon carbide charging solutions for your next design.