It fascinates me when we ship products in numbers that exceed the number of humans on the planet. The stats you’re giving mean that the average man, woman, and child in the western world probably has a double-digit number of microcontrollers.
Most of them don’t even know they have any at all.
 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
