editor's blog
Subscribe Now

A Step Up

One of the challenges of TSVs is that they’re deeper than other vias and features. Drilling those babies uses deep reactive ion etching (DRIE), which we discussed in our MEMS article earlier in the year. The Bosch process, in particular, consists of a series of etch and clean steps that can leave scalloped sidewalls and other rough features that can be hard to cover properly when filling with metal.

French company Alchimer, which focuses on chemical deposition of “nanometric films” for a variety of leading technologies, has announced a new barrier layer that they say guarantees 100% step coverage. The material is NiB, in contrast to the more traditional TaN and TiN, which, they claim, tend to be used mostly because of their compatibility with standard chemical and plasma vapor deposition (CVD and PVD) processes.

They claim that the NiB has barrier properties similar to TiN and copper, while having diffusion characteristics similar to Ta and TaN. But it also allows the subsequent copper to be filled without requiring a seed layer. The sum total of these benefits is said to save a number of cleaning and other miscellaneous process steps that are currently required, reducing cost.

They call their general process “electrografting”: they deposit a thin layer onto a non-conductive substrate using a water-based process that has molecules from liquid organic precursors of the film layer bonding to the electrons in the substrate. These precursors act as seeds for the rest of the layer.

More info in their release

Leave a Reply

featured blogs
Jan 17, 2020
I once met Steve Wozniak, or he once met me (it's hard to remember the nitty-gritty details)....
Jan 17, 2020
[From the last episode: We saw how virtual memory helps resolve the differences between where a compiler thinks things will go in memory and the real memories in a real system.] We'€™ve talked a lot about memory '€“ different kinds of memory, cache memory, heap memory, vi...
Jan 16, 2020
While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December ...
Jan 16, 2020
Betting on Hydrogen-Powered Cars On-demand DRC within P&R cuts closure time in half for MaxLinear Functional Safety Verification For AV SoC Designs Accelerated With Advanced Tools Automating the pain out of clock domain crossing verification Mentor unpacks LVS and LVL iss...

Featured Video

RedFit IDC SKEDD Connector

Sponsored by Wurth Electronics and Mouser Electronics

Why attach a header connector to your PCB when you really don’t need one? If you’re plugging a ribbon cable into your board, particularly for a limited-use function such as provisioning, diagnostics, or testing, it can be costly and clunky to add a header connector to your BOM, and introduce yet another component to pick and place. Wouldn’t it be great if you could plug directly into your board with no connector required on the PCB side? In this episode of Chalk Talk, Amelia Dalton chats with Ben Arden from Wurth Electronics about Redfit, a slick new connector solution that plugs directly into standard via holes on your PCB.

Click here for more information about Wurth Electronics REDFIT IDC SKEDD Connector