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This is unbelievable.. doesn’t t

This is unbelievable.. doesn’t the VP of Engineering at IC Manage have something better to do than troll around competitor websites buying up domains and posting lies and disinformation? Just plain sleaze.. why would anyone do business with a company like this?

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featured blogs
Nov 23, 2022
The current challenge in custom/mixed-signal design is to have a fast and silicon-accurate methodology. In this blog series, we are exploring the Custom IC Design Flow and Methodology stages. This methodology directly addresses the primary challenge of predictability in creat...
Nov 22, 2022
Learn how analog and mixed-signal (AMS) verification technology, which we developed as part of DARPA's POSH and ERI programs, emulates analog designs. The post What's Driving the World's First Analog and Mixed-Signal Emulation Technology? appeared first on From Silicon To So...
Nov 21, 2022
By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize… ...
Nov 18, 2022
This bodacious beauty is better equipped than my car, with 360-degree collision avoidance sensors, party lights, and a backup camera, to name but a few....

featured video

Unique AMS Emulation Technology

Sponsored by Synopsys

Learn about Synopsys' collaboration with DARPA and other partners to develop a one-of-a-kind, high-performance AMS silicon verification capability. Please watch the video interview or read it online.

Read the interview online:

featured paper

How SHP in plastic packaging addresses 3 key space application design challenges

Sponsored by Texas Instruments

TI’s SHP space-qualification level provides higher thermal efficiency, a smaller footprint and increased bandwidth compared to traditional ceramic packaging. The common package and pinout between the industrial- and space-grade versions enable you to get the newest technologies into your space hardware designs as soon as the commercial-grade device is sampling, because all prototyping work on the commercial product translates directly to a drop-in space-qualified SHP product.

Click to read more

featured chalk talk

Beyond the SOT23: The Future of Smaller Packages

Sponsored by Mouser Electronics and Nexperia

There is a megatrend throughout electronic engineering that is pushing us toward smaller and smaller components and printed circuit boards. In this episode of Chalk Talk, Tom Wolf from Nexperia and Amelia Dalton explore the benefits of a smaller package size for the SOT23. They investigate how new package sizes for this SMD can lower your BOM, decrease your board space and more.

Click here for more information about Nexperia SOT23 Surface-Mounted Package Products