editor's blog
Subscribe Now

Photonics at Leti

CEA-Leti, a French research consortium, reviewed their technology projects during Semicon West last week. I got a chance to speak with Leti’s Hughes Metras afterwards to talk a bit about their photonics work.

They see light as being a useful data conduit when information at the rate of around 10 Mbps needs to be carried over 1 km. Using that product – 10 Gbps-m – as a threshold, it means that for small distances on the order of 1 mm, you need to be transferring data at the rate of about 10 Tbps. We’re certainly not there yet – he sees that happening 5-10 years from now.

Their focus is on silicon integration because of the rapid cost improvements that tend to accrue to things associated with silicon just because of the high volumes produced. They’ve worked on all of the individual photonic components, and are now starting to assemble them into systems. They’ve solicited projects from a number of companies and organizations doing work in this area to combine onto multi-project wafers. That not only makes better use of the wafers, but also provides a variety of configurations that help to push the technology in different directions.

When we looked at optical design tools before, we noted that neither Code V nor LightTools could be used to design photonics. I asked about tools: Mr. Metras sees photonics design being incorporated into standard EDA tools. Right now they’re developing PDKs, process rules, and IP blocks, but no standard commercial tools have picked this up yet.

Work in this area is extending beyond consortia. A number of unnamable IDMs are doing work to combine photonics with CMOS, and Leti hopes to announce a major partnership early next year.

A brief summary of Leti’s photonics work can be found here

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Nexperia GaN Power Proliferating in All Things Motor Control/Drive
Sponsored by Mouser Electronics and Nexperia
In this episode of Chalk Talk, Art Gonsky from Nexperia and Amelia Dalton discuss the biggest challenges of electric motors and controllers and how GaN power solutions can help solve these issues. TheyĀ  also investigate how silicon, silicon carbide and GaN power solutions compare and how Nexperia and NXP technologies can get your next motor control design up and running in no time!Ā Ā Ā Ā Ā 
Mar 25, 2026
26,621 views