editor's blog
Subscribe Now

Other EBL Guys

While complementary e-beam lithography (CEBL) provides a new twist on how EBL can be worked into high-volume manufacturing, there are a couple other companies actively pursuing EBL technology.

KLA-Tencor has a technology they refer to as REBL: reflective electron beam lithography. Funded as a DARPA project, it amasses a whopping 106 beams. Interestingly, the payoff is throughput that’s 100x faster than what a single-beam can do, giving a decidedly sub-linear throughput boost. They’re seeing up to 10 wafers/hour for via and contact layers, and 2 wafers/hour for metal.

Meanwhile, a small company in Delft, Mapper, is working on a 13,000-beam machine that can do 10 wafers/hour per unit, clusterable in tens for 100 wafers/hour.

More information at the Mapper site. There appears to be no info on REBL on KLA-Tencor’s actual site, but you can find various bits by searching “REBL KLA.”

Leave a Reply

featured blogs
Jul 3, 2020
[From the last episode: We looked at CNNs for vision as well as other neural networks for other applications.] We'€™re going to take a quick detour into math today. For those of you that have done advanced math, this may be a review, or it might even seem to be talking down...
Jul 2, 2020
Using the bitwise operators in general -- and employing them to perform masking, bit testing, and bit setting/clearing operations in particular -- can be extremely efficacious....
Jul 2, 2020
In June, we continued to upgrade several key pieces of content across the website, including more interactive product explorers on several pages and a homepage refresh. We also made a significant update to our product pages which allows logged-in users to see customer-specifi...

Featured Video

Product Update: Advances in DesignWare Die-to-Die PHY IP

Sponsored by Synopsys

Hear the latest about Synopsys' DesignWare Die-to-Die PHY IP for SerDes-based 112G USR/XSR and parallel-based HBI interfaces. The IP, available in advanced FinFET processes, addresses the power, bandwidth, and latency requirements of high-performance computing SoCs targeting hyperscale data center, AI, and networking applications.

Click here for more information about DesignWare Die-to-Die PHY IP Solutions

Featured Paper

Cryptography: How It Helps in Our Digital World

Sponsored by Maxim Integrated

Gain a basic understanding of how cryptography works and how cryptography can help you protect your designs from security threats.

Click here to download the whitepaper

Featured Chalk Talk

Powering Your Innovation: Intel Enpirion Power Solutions

Sponsored by Mouser Electronics and Intel

Providing clean power for today’s complex FPGAs is a bewildering challenge. These devices can pose serious difficulties for conventional solutions based on buck converters. In this episode of Chalk Talk, Amelia Dalton chats with Jenanne Vaccaro from Intel about the new Intel Enpirion EC2650 6 amp power solution that offers significant advantages in powering complex FPGA and ASIC designs.

Click here for more information about the Intel Enpirion® EC2650QI DC-DC Voltage Bus Converter