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Sep 23, 2020
CadenceLIVE 2020 India, our first digital conference held on 9-10 September and what an event it was! With 75 technical paper presentations, four keynotes, a virtual exhibition area, and fun... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Sep 22, 2020
If you are at all interested in digital signal processing (DSP), then the DSP Online Conference is the place to '€œsee and be seen'€ -- register now before all the good seats are snapped up!...
Sep 22, 2020
I am a child of the 80s.  I grew up when the idea of home computing was very new.  My first experience of any kind of computer was an Apple II that my Dad brought home from work. It was the only computer his company possessed, and every few weeks he would need to cr...
Sep 18, 2020
[From the last episode: We put the various pieces of a memory together to show the whole thing.] Before we finally turn our memory discussion into an AI discussion, let'€™s take on one annoying little detail that I'€™ve referred to a few times, but have kept putting off. ...

Featured Video

AI SoC Chats: Host Processor Interconnect IP for AI Accelerators

Sponsored by Synopsys

To support host-to-AI accelerator connectivity, AI chipsets can use PCI Express, CCIX, and/or CXL, and each have their benefits. Learn how to find the right interconnect for your AI SoC design.

Click here for more information about DesignWare IP for Amazing AI

Featured Paper

4 audio trends transforming the automotive industry

Sponsored by Texas Instruments

The automotive industry is focused on creating a comfortable driving experience – but without compromising fuel efficiency or manufacturing costs. The adoption of these new audio technologies in cars – while requiring major architecture changes – promise to bring a richer driving and in-car communication experience. Discover techniques using microphones, amplifiers, loudspeakers and advanced digital signal processing that help enable the newest trends in automotive audio applications.

Click here to download the whitepaper

Featured Chalk Talk

Maxim's Himalaya uSLIC Portfolio

Sponsored by Mouser Electronics and Maxim Integrated

With form factors continuing to shrink, most engineers are working hard to reduce the number of discrete components in their designs. Power supplies, in particular, are problematic - often requiring a number of large components. In this episode of Chalk Talk, Amelia Dalton chats with John Woodward of Maxim Integrated about how power modules can save board space, improve performance, and help reliability.

Click here for more information about Maxim Integrated Himalaya uSLIC™ MAXM1546x Step-Down Power Modules