industry news
Subscribe Now

Architects of Modern Power Releases New Standard for High Power Advanced Bus Dc-Dc Converter

TUALATIN, STOCKHOLM, and KYOTO —19 October 2016 — The Architects of Modern Power® (AMP Group®) consortium today announced a new standard aimed to keep designers of high-performance datacom and telecom equipment one step ahead as cloud computing and IoT continue to drive power density and power requirements higher. Initially supporting 1 kW of output power, the ‘HPABC?qbAMP™’ standard establishes common mechanical and electrical specifications for high power advanced bus dc-dc converters in distributed power systems.

The new ‘HPABC?qbAMP’ standard builds upon the previously released “ABC?ebAMP™’ and ‘ABC?qbAMP™’ that defined standards for eighth brick and quarter brick advanced bus modules ranging from 264 to 300 W and 420 to 468 W, respectively. Measuring 58.42 x 36.83 mm, the ‘HPABC?qbAMP’ standard occupies the same board space as a standard quarter brick converter. The new specification defines the mechanical and electrical specifications for analog and digital versions, as well as compatible software configuration files for the digital version. The first products to meet with this new ‘HPABC?qbAMP’ standard will be announced by AMP Group members early next year.

AMP Group spokesperson and CUI Senior VP, Mark Adams, commented, “Consumers continue to drive the ever-higher demand for IoT connected devices, which puts an increasing strain on data centers and the infrastructure required to power them,” Martin Hägerdal, President of Ericsson Power Modules said, “This new standard continues our commitment to provide leading-edge power technology in support of our belief that advanced power is becoming a must have across various industries,” while Murata Power Solutions’ President & CEO, Steve Pimpis, added, “Ultimately, the introduction of the ‘HPABC-qbAMP’ standard is the AMP Group’s next step in supporting designers as power and performance demands continue their steady climb upwards.”

The AMP Group is an alliance formed in 2014 between CUI, Ericsson Power Modules and Murata to define a true multi-sourced, high performance power ecosystem for distributed power architectures. AMP Group members have set out to agree upon common mechanical and electrical specifications for their products, including standardization of monitoring, control and communications functions, as well as common configuration files for plug-and-play interoperability between modules from each firm.

About Architects of Modern Power

The AMP Group is a consortium of leading power companies collaborating to create a defacto industry standard for distributed power architecture designs by jointly defining and developing a roadmap of advanced power solutions. It comprises CUI Inc, Ericsson Power Modules and Murata. The consortium aims to define the future of power by providing a complete ecosystem for distributed power designs, offering the best technological solution as well as reducing supply chain risk.

About CUI?CUI Inc is a technology company focused on the development and distribution of electronic components. At the leading edge of power supply design, the organization supports customers as they strive to improve the energy efficiency and environmental credentials of their application.  The company’s power group is complemented by a portfolio of world-class board level components, consisting of interconnect, sound, motion control and thermal products.  An unwavering commitment to create collaborative partnerships with customers and a drive to see that their design project is a success has been a hallmark of CUI’s sustained growth since its founding in 1989.   As a leader in the industry, CUI will continue to invest in the future through new technologies, talented employees, expanded manufacturing capabilities, and a growing global reach.
CUI Inc is a subsidiary of CUI Global, Inc., a publicly traded company whose common stock trades on the NASDAQ Exchange under the symbol CUI.

About Ericsson Power Modules

Ericsson is the driving force behind the Networked Society – a world leader in communications technology and services. Our long-term relationships with every major telecom operator in the world allow people, businesses and societies to fulfill their potential and create a more sustainable future.
Formed in the late seventies, Ericsson Power Modules is a division of Ericsson that primarily designs and manufactures board-mounted power solutions within a range of power from 1 W to 1000 W for use in information and communication technology applications in distributed power architectures. The products portfolio include DC-DC converters, intermediate and advanced bus converters, POL regulators, power interface modules, board power management supporting products and software. Every product design is the result of extensive research and development in power technology, broad application and system knowledge with a focus on design for environment and for manufacturing, as well as efficient logistics and global support. Ericsson Power Modules uses the latest technology and highest standards of quality and robustness for achieving the highest system performance. Ericsson, Power Modules division is headquartered in Stockholm, and has facilities in Sweden, China and USA.

About Murata

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata’s website at www.murata.com

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
24,375 views