industry news
Subscribe Now

STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package

Geneva, August 3, 2016 – STMicroelectronics has introduced a portfolio of TO-220 FullPAK (TO-220FP) wide creepage power transistors, including the world’s first 1500V super-junction MOSFET in this new important arcing-resistant package.

The TO-220FP wide creepage package is ideal for the power transistors of open-frame power supplies commonly used in equipment such as television sets and PCs, which are vulnerable to surface contamination by dust and particles that can cause high-voltage arcing between transistor terminals. The new package’s extended lead spacing of 4.25mm eliminates the special potting, lead forming, sleeving, or sealing needed to prevent the arcing when using conventional packages with 2.54mm lead spacing. Power-supply manufacturers can now meet applicable safety standards and minimize field failures without applying these additional processes, thereby simplifying manufacturing and enhancing productivity.

While providing superior arcing resistance, TO-220FP wide creepage retains the outstanding electrical properties of the popular TO-220FP. Moreover, similar outer dimensions help streamline design-in and ensure compatibility with established assembly processes. 

ST developed the TO-220FP wide creepage package by collaborating with its customer SoluM, a leading power manufacturer based in Korea. SoluM is using the superior package to create new power solutions that are more robust and cost-effective than competing products.

ST is currently ramping up production of TO-220FP wide creepage power transistors to support a major global television manufacturer. The product portfolio includes four fully qualified 600V low-RDS(ON) MDmesh™ M2 MOSFETs with current ratings from 8A to 34A. The 1500V STFH12N150K5 and 1200V STFH12N120K5, MDmesh K5 devices, will be qualified by the end of Q3 2016.

 

For further information please visit www.st.com/mosfet.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Secure Authentication ICs for Disposable and Accessory Ecosystems
Sponsored by Mouser Electronics and Microchip
Secure authentication for disposable and accessory ecosystems is a critical element for many embedded systems today. In this episode of Chalk Talk, Amelia Dalton and Xavier Bignalet from Microchip discuss the benefits of Microchip’s Trust Platform design suite and how it can provide the security you need for your next embedded design. They investigate the value of symmetric authentication and asymmetric authentication and the roles that parasitic power and package size play in these kinds of designs.
Jul 21, 2023
32,673 views