March 24, 2011
featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
featured paper
 Designing Robust 5G Power Amplifiers for the Real WorldSponsored by Keysight Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems. |
featured chalk talk
Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.