With smaller electronics, more options can be fit into the package, allowing for features such as RF transceivers for wireless communication, advanced sensors to optimally time pacing and defibrillation shocks and backup systems in case the main system fails. While integrated circuits (ICs) have taken advantage of advances in dense packaging, such as die stacking, in most cases the discrete components remain unchanged. Market pressures are now forcing improvements in the current discrete packaging.
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MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D SolversSponsored by Cadence Design Systems MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges. |
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Designing Robust 5G Power Amplifiers for the Real WorldSponsored by Keysight Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems. |