feature article
Subscribe Now

Implementing PCI Express Bridging Solutions in an FPGA

Like its predecessor, the Peripheral Component Interconnect (PCI), PCI Express is becoming a ubiquitous system interface. Unlike PCI, PCI Express adopts a Serializer/Deserializer (SERDES) interface to provide users with the scalability required for future applications. As system bandwidths increase, more applications are moving to SERDES-based interfaces like PCI Express. In the past, ASICs or ASSPs typically have been used to implement next generation interface solutions. ASICs and ASSPs were popular choices because they provided a low cost, low power design solution. However, several new FPGAs families now offer very attractive options to designers. FPGAs provide an extremely flexible platform without the long lead times and large NREs typically associated with ASICs or the inflexibility of ASSPs. Newer generation FPGAs with embedded SERDES, like the LatticeECP2M and the LatticeECP3 devices, offer designers an extremely rich, high value programmable architecture, while also offering a low cost, low power solution for serial interfaces. The same FPGAs can be used to support a variety of serial protocols like PCI Express, Gigabit Ethernet, SGMII, XAUI, Serial RapidIO, and others, providing a single FPGA platform for multiple designs.

PCI Express is also becoming the interface of choice for control plane applications, replacing older parallel interfaces like PCI. Newer generation devices use one or more PCI Express links. In a majority of devices, the PCI Express core is implemented as a PCI Express endpoint. Designers often need to connect these devices to previous generation devices that have a parallel bus (e.g., microprocessors with parallel bus interfaces). Using a low cost, low power FPGA to bridge between PCI Express and a parallel interface provides designers the flexibility to solve this problem without exceeding their system cost and power budgets.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

The Future of Intelligent Devices is Here
Sponsored by Alif Semiconductor
In this episode of Chalk Talk, Amelia Dalton and Henrik Flodell from Alif Semiconductor explore the what, where, and how of Alif’s Ensemble 32-bit microcontrollers and fusion processors. They examine the autonomous intelligent power management, high on-chip integration and isolated security subsystem aspects of these 32-bit microcontrollers and fusion processors, the role that scalability plays in this processor family, and how you can utilize them for your next embedded design.
Aug 9, 2023
31,262 views