July 21, 2015

Green Hills Software Enhances µ-velOSity Real-Time Operating System

Microchip Adds Two New PIC® MCU Families With Core-Independent Peripherals That Enable Functions for a Broad Range of Applications

July 20, 2015

Green Hills Software to Present and Exhibit at Embedded Systems Conference 2015 in Santa Clara, CA

Vector Software Announces Integration with AdaCore’s CodePeer 3.0 Static Analysis Tool

Macronix and Arrow Electronics Announce Global Distribution Partnership

Wind River Joins KDDI R&D Labs Proof-of-Concept for Advanced NFV and SDN Automated Operations

ams delivers industry’s first sensor module to integrate universal remote control, barcode emulation, color sensing, proximity and 3D gesture detection

New Waveguide Detectors Covering Frequency Ranges from 26.5 to 110 GHz Released by Pasternack

UltraSoC and Cadence's Tensilica Division collaborate to deliver universal debug for heterogeneous multicore SoCs

July 17, 2015

NXP Introduces Industry’s First Secure Total USB Type-C Solution

Amplicon introduces 4th generation Ventrix and Impact-R rackmount industrial PCs

Renesas Electronics Delivers Bluetooth® Smart Wireless Solution to Accelerate Use of Embedded Devices in IoT Applications

July 16, 2015

Water and Dust Resistant Test and Measurement Microphone

congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics

Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT

Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive

Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development

Digi-Key Partners with ARM University Program to Offer 'Lab-in-a-Box' for Participating Universities Worldwide

2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current

July 15, 2015

Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems

Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression

crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios

Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line

Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

July 14, 2015

GrammaTech's TECHx Research Team Selected as Finalist in DARPA's Cyber Grand Challenge

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