industry news
Subscribe Now

Architects of Modern Power Releases New Standard for High Power Advanced Bus Dc-Dc Converter

TUALATIN, STOCKHOLM, and KYOTO —19 October 2016 — The Architects of Modern Power® (AMP Group®) consortium today announced a new standard aimed to keep designers of high-performance datacom and telecom equipment one step ahead as cloud computing and IoT continue to drive power density and power requirements higher. Initially supporting 1 kW of output power, the ‘HPABC?qbAMP™’ standard establishes common mechanical and electrical specifications for high power advanced bus dc-dc converters in distributed power systems.

The new ‘HPABC?qbAMP’ standard builds upon the previously released “ABC?ebAMP™’ and ‘ABC?qbAMP™’ that defined standards for eighth brick and quarter brick advanced bus modules ranging from 264 to 300 W and 420 to 468 W, respectively. Measuring 58.42 x 36.83 mm, the ‘HPABC?qbAMP’ standard occupies the same board space as a standard quarter brick converter. The new specification defines the mechanical and electrical specifications for analog and digital versions, as well as compatible software configuration files for the digital version. The first products to meet with this new ‘HPABC?qbAMP’ standard will be announced by AMP Group members early next year.

AMP Group spokesperson and CUI Senior VP, Mark Adams, commented, “Consumers continue to drive the ever-higher demand for IoT connected devices, which puts an increasing strain on data centers and the infrastructure required to power them,” Martin Hägerdal, President of Ericsson Power Modules said, “This new standard continues our commitment to provide leading-edge power technology in support of our belief that advanced power is becoming a must have across various industries,” while Murata Power Solutions’ President & CEO, Steve Pimpis, added, “Ultimately, the introduction of the ‘HPABC-qbAMP’ standard is the AMP Group’s next step in supporting designers as power and performance demands continue their steady climb upwards.”

The AMP Group is an alliance formed in 2014 between CUI, Ericsson Power Modules and Murata to define a true multi-sourced, high performance power ecosystem for distributed power architectures. AMP Group members have set out to agree upon common mechanical and electrical specifications for their products, including standardization of monitoring, control and communications functions, as well as common configuration files for plug-and-play interoperability between modules from each firm.

About Architects of Modern Power

The AMP Group is a consortium of leading power companies collaborating to create a defacto industry standard for distributed power architecture designs by jointly defining and developing a roadmap of advanced power solutions. It comprises CUI Inc, Ericsson Power Modules and Murata. The consortium aims to define the future of power by providing a complete ecosystem for distributed power designs, offering the best technological solution as well as reducing supply chain risk.

About CUI?CUI Inc is a technology company focused on the development and distribution of electronic components. At the leading edge of power supply design, the organization supports customers as they strive to improve the energy efficiency and environmental credentials of their application.  The company’s power group is complemented by a portfolio of world-class board level components, consisting of interconnect, sound, motion control and thermal products.  An unwavering commitment to create collaborative partnerships with customers and a drive to see that their design project is a success has been a hallmark of CUI’s sustained growth since its founding in 1989.   As a leader in the industry, CUI will continue to invest in the future through new technologies, talented employees, expanded manufacturing capabilities, and a growing global reach.
CUI Inc is a subsidiary of CUI Global, Inc., a publicly traded company whose common stock trades on the NASDAQ Exchange under the symbol CUI.

About Ericsson Power Modules

Ericsson is the driving force behind the Networked Society – a world leader in communications technology and services. Our long-term relationships with every major telecom operator in the world allow people, businesses and societies to fulfill their potential and create a more sustainable future.
Formed in the late seventies, Ericsson Power Modules is a division of Ericsson that primarily designs and manufactures board-mounted power solutions within a range of power from 1 W to 1000 W for use in information and communication technology applications in distributed power architectures. The products portfolio include DC-DC converters, intermediate and advanced bus converters, POL regulators, power interface modules, board power management supporting products and software. Every product design is the result of extensive research and development in power technology, broad application and system knowledge with a focus on design for environment and for manufacturing, as well as efficient logistics and global support. Ericsson Power Modules uses the latest technology and highest standards of quality and robustness for achieving the highest system performance. Ericsson, Power Modules division is headquartered in Stockholm, and has facilities in Sweden, China and USA.

About Murata

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata’s website at www.murata.com

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving Reliable Wireless IoT
Wireless connectivity is one of the most important aspects of any IoT design. In this episode of Chalk Talk, Amelia Dalton and Brandon Oakes from CEL discuss the best practices for achieving reliable wireless connectivity for IoT. They examine the challenges of IoT wireless connectivity, the factors engineers should keep in mind when choosing a wireless solution, and how you can utilize CEL wireless connectivity technologies in your next design.
Nov 28, 2023
20,138 views