industry news
Subscribe Now

Molex Expands Line of Microminiature SlimStack™ Fine-Pitch Board-to-Board Connectors

LISLE, IL – July 7, 2015 – Molex Incorporated has launched two new versions of SlimStack™ Fine-Pitch SMT Board-to-Board Connectors.  The SlimStack™ Hybrid Power SMT Board-to-Board Connector and the SlimStack Armor™ SMT Board-to-Board Connectorcombine extra power lines into a signal connector.

Designed for smartphones, portable audio players, and mobile medical devices, the Molex SlimStack connector portfolio offers manufacturers a wide selection of low profile, narrow width interface options in various heights and circuit sizes for space savings and design flexibility.

“Mobile device makers need better strategies to increase available signal and power, and shorten battery charge time, without monopolizing more space,” said Mike Higashikawa, product manager, Molex.  “Our compact SlimStack connectors provide highly reliable power and signal connections for a growing range of smaller, thinner mobile devices popular with consumers.”

Molex SlimStack Hybrid Power SMT Board-to-Board Connectors primarily support power functionality in battery and other mobile device power applications.  Featuring a 0.40mm pitch and ultra-low profile 0.75mm mated height, the hybrid connectors enable high-current carrying capability, with a dual-contact structure for excellent power and signal reliability.  The SlimStack hybrid connector delivers 6.0A power, 0.3A signal.

Featuring a 0.35mm pitch and 0.60mm mated height, Molex SlimStack Armor SMT Board-to-Board Connectors primarily support signal functionality in mobile devices and other tight-packaging applications.  When additional power is needed for value-added features, such as fast battery charging or LED flash functions, the metal housing covers on SlimStack Armor connectors can serve as power nails to deliver up to 3.0A of extra power.  All Molex SlimStack connectors provide secure terminal retention.  Constructed of high strength copper alloy, dual contacts on the signal and power terminals reduce the risk of power or signal disruption due to shock or vibration or drops.

SlimStack Armor connectors feature robust metal covers on the housing corners to prevent damage from misalignment during mating.  By loading terminals from the bottom, Armor connectors create a ‘canopy’ style cover in the housing, which serves as a barrier to prevent terminal pullout during rough angled unmating.  The cover also prevents housing damage by absorbing wear and tear of multiple mating cycles.  A wide chamfered alignment area makes the connector and plug easier to guide together.  Audible and tactile feedback confirms when a SlimStack connector is properly mated to a device.

“Whether a device maker needs space savings in a ‘power plus signal’ or ‘signal plus power’ connector with a more robust housing, our Molex SlimStack connectors check every box,” adds Higashikawa.

For more information about Molex SlimStack connectors, please visit:  www.molex.com/link/slimstack.html.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting.  Established in 1938, the company operates 50 manufacturing locations in 17 countries.  The Molex website iswww.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Oct 2, 2023
26,113 views