industry news
Subscribe Now

PRO DESIGN Launches Complete Family of Virtex® UltraScale™ 440 FPGA Based Prototyping Systems

San Francisco, 08 June 2015 – PRO DESIGN, veteran in the E²MS and EDA industry, who announced three months ago as first vendor worldwide a Xilinx Virtex® UltraScale™ XCVU440 FPGA Prototyping solution will launch and demonstrate today the complete proFPGA product family consisting of the proFPGA UNO, DUO and QUAD system, based on the latest FPGA technology at the Design Automation Conference (DAC) in San Francisco.

The fully verified and tested systems are the next generation of PRO DESIGNs modular and scalable high performance multi FPGA Prototyping solutions. Scalable from 1 up to 4 pluggable Xilinx Virtex® UltraScale™ XCVU440 based FPGA modules the QUAD system offers a capacity of up to 120 M ASIC gates, which is nearly a factor of 2.5 more compared to the previous Virtex® 7 based generation. Up to five proFPGA QUAD systems with overall 20 FPGA modules can be easily connected together to increase the capacity up to 600 M ASIC gates. 

The big advantage of the proFPGA concept is its modularity. The user can for example use the UNO system for IP or sub designs development and can reuse the FPGA modules for complete SoC and ASIC prototyping by simply plugging the same proFPGA Virtex® 7 or UltraScale™ FPGA modules on a DUO or QUAD motherboard. This innovative technology and methodology offers maximum reusability and highest return on invest, because the new proFPGA VUS 440 product family is fully compatible (up and down) to the previous proFPGA generation. That means all proFPGA motherboards, FPGA modules, daughter cards and accessories can be used in combination with the new proFPGA XCVU440 FPGA modules. Further it allows the customer to mix and match the new Xilinx Virtex® UltraScale™ FPGA technology with the previous Virtex® 7 and Zynq™ technology in one system. 

The system comes with the proFPGA Builder software, which provides an extensive set of features, like advanced clock management, integrated self- and performance test, automatic board detection and I/O voltage programming, system scan- and safety mechanism, and quick remote system configuration and monitoring through USB, Ethernet or PCIe, which simplifies the usage of the proFPGA system tremendously.

Availability 

The proFPGA UNO, DUO and QUAD VUS 440 systems are available for early adopter customers now. The general availability will be in Q4 2015.
Demonstration
PRO DESIGN will demonstrate the proFPGA VUS 440 systems at the DAC show in San Francisco, California at booth #2923, June 8 – 10, 2015.

For more information please visit: www.proFPGA.com

About proFPGA

The proFPGA product family is a complete, scalable, and modular multi FPGA Prototyping solution, which fulfills highest needs in the area of ASIC and IP Prototyping and pre-silicon software development. The proFPGA product series consists of different types of motherboards, various Xilinx Virtex® UltraScale™, Virtex® 7 and Zynq™ based FPGA Modules, a set of interconnection boards/cables, and a large range of daughter boards like DDR3/4 memory boards or high speed interface boards (PCIe, USB 3.0, Gigabit Ethernet, SATA, DVI, etc.). It addresses customers who need a scalable and most flexible high performance FPGA based Prototyping solution for early software development and IP/ASIC verification. The innovative system concept and technology offer best in class reusability for several projects, which guarantees the best return on invest.

About PRO DESIGN

The privately held company was founded in 1982 and has around 85 employees, with various facilities in Germany, France and USA. PRO DESIGN has more than 33 years of experience in the EDA market and as provider in the E²MS market. It has built extensive knowledge in the areas of FPGA board development, electronic engineering, FPGA design, high performance PCB design, construction, production, assembly and testing.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
17,777 views