industry news
Subscribe Now

Microchip Announces a New Family of 1.8V Low-Power 16-Mbit Serial Quad I/O™ SuperFlash® Memory Devices

CHANDLER, Ariz., Oct. 28, 2014 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced a new family of 1.8V Serial Quad I/O™ (SQI) SuperFlash® Memory devices—SST26WF016B.  This device offers 16-Mbit of memory and is manufactured with Microchip’s high-performance SuperFlash technology, which provides the industry’s fastest erase times and superior reliability.

The SST26WF016B provides the fastest erase times of any competing device due to the use of SuperFlash technology.  Sector and block erase commands are completed in just 18 ms and a full chip erase operation is completed in 35 ms.  Competing devices require in the range of 10 to 20 seconds to complete a full chip erase operation, making SST26WF016B approximately 400 times faster.  The fast erase times can provide a significant cost savings to customers by minimizing the time required for testing and firmware updates, therefore increasing their manufacturing throughput.

The SQI interface is a high-speed 104 MHz 4-bit multiplexed I/O serial interface which allows for high-data throughput in a low pin-count package.  This interface enables low latency execute-in-place (XIP) capability, allowing programs to be stored and executed directly from the Flash memory and eliminating the need for code shadowing on a RAM device.  The SST26WF016B provides faster data throughput than a comparable x16 parallel Flash device without the associated high cost and high-pin count of parallel Flash.  The SQI interface also offers full command-set backwards compatibility to traditional Serial Peripheral Interface (SPI) protocol.

Designed for low-power consumption, the SST26WF016B helps maximize battery life in portable applications.  Standby current consumption is 10 µA typical and a deep power-down mode further reduces current consumption to 2.5 µA typical.  Active read current at 104 MHz is 15 mA typical.  The combination of 1.8V operation with low-power consumption and small form factor packaging makes the SST26WF016B an excellent choice for applications such as portable medical devices, Bluetooth® headsets, GPS, camera modules and hearing aids.

The SST26WF016B offers excellent quality and reliability with 100 years data retention and device endurance of over 100,000 erase/write cycles.  Enhanced safety features include software write protection of individual blocks for flexible data/code protection and a One-Time  Programmable (OTP) 2 Kbyte Secure ID area.  These features protect against unauthorized access and malicious read, program and erase intentions.  The device also includes a JEDEC-compliant Serial Flash Discoverable Parameter (SFDP) table, which contains identifying information about the function and capability of the SST26WF016B in order to simplify software design.  

“The new SST26WF016B devices combine the benefits of low-power 1.8V operation and fast Serial Quad I/O operation with the reliability and industry fastest erase times inherent to our SuperFlash technology,” said Randy Drwinga, vice president of Microchip’s Memory Products Division.  “This combination provides designers with an ideal Flash memory solution for portable battery-powered embedded designs.”

Pricing & Availability 

The SST26WF016B device is available today for sampling and volume production in 8-contact WSON (6×5 mm), 8-lead SOIC (150 mil) and 8-ball XFBGA (Z-Scale) packages, starting at $0.93 each in 10,000-unit quantities.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site athttp://www.microchip.com/get/X7SV.  To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip’s authorized distribution partners.

Follow Microchip:

About Microchip Technology

Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/453F.

 
 

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
25,848 views