industry news
Subscribe Now

LSR introduces comprehensive Cloud Connectivity platform for IoT featuring new Wi-Fi module

CEDARBURG, Wis., Sept. 3, 2014 /PRNewswire/ — LSR, a global leader in wireless product development solutions and services, announces the new TiWiConnect™ platform, the first true end-to-end “Internet of Things” (IoT) solution for connecting devices to a cloud server.  This cloud connectivity enables consumer and industrial products to feature smartphone apps and web interfaces for both end-users and service professionals. 

“For over 30 years, our customers have looked to LSR to help them implement wireless technologies that re-define the customer experience with their products,” said Bill Steinike, President of LSR.  “With TiWiConnect, they will have the most comprehensive, straight-forward IoT platform solution available to add cloud connectivity, empowering the user to interact with their product at virtually any time and from anywhere.”

TiWiConnect is the first platform that encompasses all the necessary hardware, software, and cloud services needed to create a connected product.  From the wireless module placed within the product, to processing and storage capabilities on a secure cloud server, to smartphone and web apps, all these elements were designed to work seamlessly together with minimal design time and effort.

“The TiWiConnect recipe is unlike any other IoT platform available today, because it encompasses the hardware module, the cloud capabilities, and app solutions that a connected product needs,” added Dave Burleton, VP of Marketing for LSR.  “And customers are excited to learn that it is all developed and supported by the LSR team, providing them with a single partner in their product development.”

LSR is also introducing the TiWi-C-W™ Wi-Fi module, which will feature a pre-loaded cloud agent for the TiWiConnect solution.  This IEEE 802.11 b/g/n WLAN module features an on-board Cortex M3 application processor in one of the smallest footprints available on the market, only 10.5 x 10.5 mm.  For product applications that feature an existing microcontroller, the TiWi-C-W can also run in a hosted operation mode using the innovative TiWiConnect LIFT software protocol.  This software dramatically simplifies the development necessary to stream data to the cloud via Wi-Fi. 

“The new TiWi-C-W module represents the first of a series of modules that will be pre-loaded for the TiWiConnect platform,” said Dave Burleton.  “By offering a powerful module along with innovative software that simplifies the design process for our customers, we are helping our customers quickly address the challenges of designing their products for cloud connectivity.”

Live, personal demonstrations of the TiWiConnect platform are available by request.  Development kits featuring a simple out of the box demo with iPhone and web connectivity, will be commercially available later this fall, with initial units available earlier for select customers.  The TiWi-C-W module will be competitively priced at an MSRP of $11.49. 

About LSR

LS Research is a global leader in enabling advanced wireless technology platforms including Cellular, Wi-Fi, Bluetooth®, BLE, RFID, NFC, 802.15.4, DECT, and ZigBee®. LSR is the only wireless product development company providing turnkey M2M System Solutions with Design Services, on-site FCC / IC / CE Testing and Certification, and a broad line of RF modules and antennas. Learn more at www.lsr.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

OPTIGA™ TPM SLB 9672 and SLB 9673 RPI Evaluation Boards
Sponsored by Mouser Electronics and Infineon
Security is a critical design concern for most electronic designs today, but finding the right security solution for your next design can be a complicated and time-consuming process. In this episode of Chalk Talk, Amelia Dalton and Andreas Fuchs from Infineon investigate how Infineon’s OPTIGA trusted platform module can not only help solve your security design concerns but also speed up your design process as well.
Jun 26, 2023
34,557 views