industry news
Subscribe Now

Allegro Microsystems, LLC Introduces New Galvanically Isolated Current Sensor IC

Worcester, MA – August 28, 2014 – Allegro MicroSystems, LLC introduces a new Allegro current sensor IC that is an economical and precise solution for AC current sensing in industrial, commercial, and communications systems. Allegro’s ACS726 is the first current sensor IC to include a fully differential back end amplifier that can be used to adjust gain and bandwidth via external RC networks. The back end amplifier is fully independent and when unused, can be powered down to reduce power consumption. The fully differential output of this device gives better immunity to output offset drift as well as common mode noise.

The device package allows for easy implementation by the customer. Typical applications include motor control, load detection and management, switched-mode power supplies, and over current fault protection.

The device consists of a precise, low-offset, linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic field to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy after packaging.

The output of the device has a positive differential voltage (VOUTP – VOUTN) when an increasing current flows through the primary copper conduction path (from pins 1 through 6, to pins 7 through 12), which is the path used for current sensing. The internal resistance of this conductive path is 1.1 m? typical, providing low power loss.

The terminals of the conductive path are electrically isolated from the sensor IC signal leads (pins 13 through 24). This allows the ACS726 current sensor IC to be used in high-side current sense applications without the use of high-side differential amplifiers or other costly isolation techniques.

The ACS726 is provided in a small, low-profile surface mount QSOP-24 package (suffix LF). The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the device is Pb-free, except for flip-chip high-temperature Pb-based solder balls, currently exempt from RoHS. The device, excluding the BAE, is fully calibrated prior to shipment from the factory.

Pricing for 1,000 pieces is as follows:

  • ACS726LLFTR-20AB-T:       $1.73
  • ACS726LLFTP-40AB-T:        $1.73 

About Allegro

Allegro MicroSystems, LLC is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro’s innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. Allegro is headquartered in Worcester, Massachusetts (USA) with design, applications, and sales support centers located worldwide. Further information about Allegro can be found at www.allegromicro.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Embedded Storage in Green IoT Applications
Sponsored by Mouser Electronics and Swissbit
In this episode of Chalk Talk, Amelia Dalton and Martin Schreiber from Swissbit explore the unique set of memory requirements that Green IoT designs demand, the roles that endurance, performance and density play in flash memory solutions, and how Swissbit’s SD cards and eMMC technologies can add value to your next IoT design.
Oct 25, 2023
23,881 views