EEJournal

industry news
Subscribe Now
April 23, 2013

Jumpstart and explore sensor fusion applications with new Sensor Hub BoosterPack from Texas Instruments

San Jose, CA (April 23, 2013) – Expanding its low-cost microcontroller (MCU) development ecosystem with sensor fusion technology, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the Sensor Hub BoosterPack for the Tiva™ C Series TM4C123G LaunchPad at DESIGN West 2013. This new Sensor Hub BoosterPack (BOOSTXL-SENSHUB) is a cost-effective, plug-in daughter card that allows ARM® Cortex™-M4 MCU developers to create products with up to seven types of motion and environmental sensing capabilities. This easy-to-use BoosterPack and accompanying TivaWare™ software enables measurement of pressure, humidity, ambient and infrared (IR) light along with temperature and motion (including acceleration, orientation and compass). Developers can use the BOOSTXL-SENSHUB board to create many sensor fusion applications, including global positioning system (GPS) tracking, home and building automation, portable consumer electronics, games and many more applications. 

The BOOSTXL-SENSHUB BoosterPack can leverage the advanced processing, floating-point and communication capabilities of TI’s Tiva C SeriesTM4C123GH6 ARM Cortex-M4 MCU for enhanced sensor accuracy. TI’s TivaWare software, provided with the LaunchPad kit, includes an easy-to-use Sensor Driver Library, providing developers with a sensor fusion API and several example applications that demonstrate how each of the sensors operate individually or in collaboration. The ‘Air Mouse’ is an example of a sensor fusion application that can be used to kick start design ideas and innovation for other multi-sensor applications. The BOOSTXL-SENSHUB can also be bundled with TI’s connectivity solutions, enabling developers to “cut the cords” and create wireless sensing applications. 

Similarly, TivaWare software also includes the Peripheral Driver Library to configure and operate the on-chip peripherals with a set of example applications. These applications demonstrate the capabilities of the Tiva TM4C123GH6 MCU, as well as provide a starting point for users to develop the final application for use on the Tiva C Series LaunchPad and BOOSTXL-SENSHUB BoosterPack

Features and benefits of the BOOSTXL-SENSHUB kit:

  • Hardware compatible with existing MSP430™ (MSP-EXP430G2) and C2000™ (LAUNCHXL-F28027) LaunchPads, allowing developers to evaluate sensor functionalities on TI-developed MCU platforms.
  • Optional RF extension module (EM) adaptor enables Bluetooth®, ZigBee®, Wi-Fi and 6LoWPAN connectivity for wireless and remote sensing applications.
  • TI’s TMP006 contactless IR temperature sensor provides accurate temperature measurements for the object it sees.
  • Includes BoosterPack XL connection standard with two pairs of 10-pin headers for LaunchPad interface and additional Tiva C Series-based expansion signals.
  • Variety of tool chains supported, including TI’s Code Composer Studio v.6, so developers can design in the most integrated development environment (IDE) with which they are most comfortable.

Pricing and availability

Developers can immediately order the TI Sensor Hub BoosterPack (BOOSTXL-SENSHUB) for USD $49.99 from TI’s eStore or authorized distributors. For a limited time only, an exclusive bundle for the Tiva C Series TM4C123G LaunchPad and Sensor Hub BoosterPack is available for the promotional price of USD $49.99 (regular price: USD $59.99) on the eStore only. 

Find out more about TI’s Tiva ARM MCUs, LaunchPad ecosystem and software:

Leave a Reply

featured blogs
BoardSurfers: Training Insights: Design Effortlessly Using Structures in Allegro X
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
More from Cadence...
Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
More from Synopsys...
One Robotic Step Closer to Humanoid Robots in the Home
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
More from Max's Cool Beans...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Gas Monitoring and Metering with Sensirion SFC6000/SFM6000 Solutions
Sponsored by Mouser Electronics and Sensirion
In this episode of Chalk Talk, Amelia Dalton and Negar Rafiee Dolatabadi from Sensirion explore the benefits of Sensirion’s SFM6000 Flow Meter and SFC Flow Controller. They examine how these solutions can be used in a variety of applications and how you can get started using these technologies for your next design.
Click here for more information about Sensirion SFC6000D Mass Flow Controllers
Jan 17, 2024
14,168 views