industry news
Subscribe Now

CEVA Leads Israeli Smart Grid Consortium for the Advancement of Smart Grid Technologies

MOUNTAIN VIEW, Calif. – August 15, 2011 – CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that the Israeli Smart Grid (ISG) Consortium which it helped spearhead has received the backing of the Israeli Chief Scientist under its MAGNET R&D Program. The group consists of seven industrial partners and five academic institutions. It will use the funding for a three to five year development program focused on new technologies and algorithms for the emerging smart grid market, including communication technologies, demand response and consumption forecasting.

CEVA will offer its communications expertise to meet the needs of smart grid applications such as smart meter modems and smart home appliances. CEVA’s  background in DSP-based wireless and wired technologies  including PLC, Wi-Fi, Zigbee, LTE and WiMAX, will be the cornerstone for the development of advanced technologies aimed at delivering highly energy efficient, mass market smart grid technologies.  CEVA already has several licensees using its DSP technologies for smart grid, PLC and other intelligent energy use products.

“The use of smart grid technology is essential worldwide as we look for more efficient energy solutions. Communications and intelligent processing of information are critical requirements and CEVA’s expertise through our programmable DSP solutions plays a key role in the development of these products. The market opportunity is extremely large and, as it develops, it is also important to have a flexible architecture to be able to support evolving standards and future market requirements,” said Eran Briman, vice president of marketing at CEVA. “We are pleased to have founded the ISG Consortium together with leading members of the Israeli technology industry and academia, and are thankful for the backing of the government’s Chief Scientist through its MAGNET R&D program.” 

The ISG Consortium currently consists of seven industrial partners that, along with CEVA, also include Motorola Solutions Israel, ECI Telecom, Yitran Communications, Ruggedcom, Control Applications and Powercom; and five Israeli academic institutions, including Tel-Aviv University, Ben-Gurion University and Bar-Ilan University. The Israeli Electric Company (IEC) is also supporting the Consortium’s activities.

The MAGNET Program, in the Office of the Chief Scientist of the Ministry of Industry, Trade and Labor, sponsors innovative industry-oriented technologies to strengthen Israel’s technological expertise and enhance competitiveness. It supports both industrial companies and academic research groups to facilitate its vision of synergetic collaboration to develop new and innovative products.

About CEVA, Inc.

CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA’s IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter atwww.twitter.com/cevadsp.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

One Year of Synopsys Cloud: Adoption, Enhancements and Evolution
Sponsored by Synopsys
The adoption of the cloud in the design automation industry has encouraged innovation across the entire semiconductor lifecycle. In this episode of Chalk Talk, Amelia Dalton chats with Vikram Bhatia from Synopsys about how Synopsys is redefining EDA in the Cloud with the industry’s first complete browser-based EDA-as-a-Service cloud platform. They explore the benefits that this on-demand pay-per use, web-based portal can bring to your next design. 
Jul 11, 2023
32,873 views