Innovation in the AI and supercomputing domains is proceeding at a rapid pace, with each new advancement heralding a future more tightly interwoven with the threads of intelligence and computation. Cadence, with the release of its Millennium Platform, co-optimized with NVIDIA...
Cloud-based EDA tools are critical to accelerating AI chip design and verification; see how NeuReality leveraged cloud-based chip emulation for their 7NR1 NAPU.The post NeuReality Accelerates 7nm AI Chip Tape-Out with Cloud-Based Emulation appeared first on Chip Design....
Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.
Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.