EEJournal

fish fry
Subscribe Now
May 6, 2016

The Future is Modular

Embedded Design, FMCs and Compact PCs
by Amelia Dalton

Whether you’re designing a COTS embedded computer, a low power consumer device, or an FPGA mezzanine card enhanced project, this Fish Fry has a little something for you. This week’s episode is all about FMCs, compact PCs, the future of embedded design, and some seriously cool new battery technology. Richard Avry (4DSP) joins us to chat about why he believes the future is modular, and what open standards like FMC and VPX buy us as engineers. Doug Patterson (Aitech) and I discuss the role of compact PCs in low power embedded systems and the challenges of designing compute platforms for millitary and aerospace applications. Also this week, we check out how University of California Irvine is changing the face of battery technology – one nanowire at a time. 

 

 

Download this episode (right click and save)

Links for May 6, 2016

More information about 4DSP

More information about Aitech

All powered up: UCI chemists create battery technology with off-the-charts charging capacity

100k Cycles and Beyond: Extraordinary Cycle Stability for MnO2 Nanowires Imparted by a Gel Electrolyte


 

Leave a Reply

featured blogs
BoardSurfers: Training Insights: Design Effortlessly Using Structures in Allegro X
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
More from Cadence...
Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
More from Synopsys...
One Robotic Step Closer to Humanoid Robots in the Home
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
More from Max's Cool Beans...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Click here for more information about Microchip Technology PIC18-Q20 Microcontrollers
Feb 19, 2024
9,282 views