VITA, PICMG, COM-HPCTM, COM Express®, MicroSAM®, and MicroTCA® are all developing standards or updating with new additions and Samtec is moving along with them. Samtec’s involvement in standards has grown over the years, and there are no signs of that ...
AI continues to shake up the tech industry. Nvidia’s plans to buy UK-based Arm Holdings from Japan-based SoftBank illustrates that point. Nvidia GPU chipsets make-up the majority of data-center focused AI hardware applications. The Arm Holding licensee ecosystem offers a ...
If you are involved with ISO 9001 then you probably know that “continuous improvement” is the name of the game. After all Rome wasn’t built in a day, and neither was Samtec’s newly updated Outgassing Guide. Our first version of ...
Samtec Signal Integrity R&D Manager Brandon Gore recently presented “IEEE Channel Operating Margin For Channel Analysis” as part of our gEEk® spEEk webinars. gEEk spEEk allows engineers to interact with Samtec’s engineering leaders and SI experts on a variety ...
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Samtec Chalk Talks
Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips — Samtec and Mouser Electronics
Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design.
Click here for more information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips
Evaluation and Development Kits — Samtec
With signal integrity becoming increasingly challenging in today’s designs, interconnect is taking on a key role. In order to see how a particular interconnect solution will perform in our design, we really need hands-on evaluation of the technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about evaluation and development kits for high-speed interconnect solutions.
Click here for more information about Samtec Evaluation and Development Kits
0 to 112 (Gbps PAM4) in 5 Seconds – Samtec
With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.
Click here to download the Silicon-to-Silicon Solutions Guide