Samtec Blog
Samtec SI/PI Specialists Win DesignCon 2020 Best Paper Award
May 22nd
Movies have the BAFTAs and Academy Awards. Music has the GRAMMYs. Broadway has the Tonys. Global footballers have the Ballon d’Or. SI/PI engineers have the DesignCon 2020 Best Paper Award? Really? What’s that? Many people are familiar with annual ...
Watch New Severe Environment Testing Video
May 20th
Have you ever heard of Volcano Boarding? I hadn’t either, but it’s exactly what it sounds like. You get on a board made of some wood and metal, then fly down the side of an active volcano (yes, I ...
Selecting the Right Connector, Part 1
May 18th
Inventing the light bulb, phonograph, motion picture technologies, film, the mimeograph, and holding a record 1,093 patents is impressive. But, I bet Thomas Edison never had the truly difficult job of selecting the right connector system for his printed circuit boards (PCB), ...
Avnet XRF16™ Features Samtec Interconnect for 5G Applications
May 15th
The roll-out of 5G continues despite COVID-19. 5G system development moves on for any number of applications. These include Test and Measurement, Remote Radio Heads (RRHs) and Active Antenna Systems (AAS), Network Equipment and more. The demand for data means design ...
Samtec on Facebook
Samtec on Twitter
Samtec Chalk Talks
Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips — Samtec and Mouser Electronics
Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design. Click here for more information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips |
Evaluation and Development Kits — SamtecWith signal integrity becoming increasingly challenging in today’s designs, interconnect is taking on a key role. In order to see how a particular interconnect solution will perform in our design, we really need hands-on evaluation of the technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about evaluation and development kits for high-speed interconnect solutions.
Click here for more information about Samtec Evaluation and Development Kits
|
0 to 112 (Gbps PAM4) in 5 Seconds
With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology. Click here to download the Silicon-to-Silicon Solutions Guide |