Processing a component onto a PCB used to be fairly straightforward. Through-hole products, or a single or double row surface mount with a larger centerline rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller ...
The Covid-19 pandemic continues to impact our lives in both expected and unexpected ways. Unfortunately, one of the expected ways is a drop in charitable donations. Analysts predict anywhere from a 6% decrease – with many planning for a bigger decline than that. ...
In 2020, mobile traffic has skyrocketed everywhere as our planet battles a pandemic. Samtec.com saw nearly double the mobile traffic in the first two quarters than it normally sees. While these levels have dropped off from their peaks in the spring, ...
Another event popular in the tech event circuit is PCI-SIG® DevCon. While DevCon events are usually in-person around the globe, this year, like so many others events, PCI-SIG DevCon is going virtual. PCI-SIG DevCons are members-driven events that provide an opportunity ...
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Samtec Chalk Talks
Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips — Samtec and Mouser Electronics
Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design.
Click here for more information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips
Evaluation and Development Kits — Samtec
With signal integrity becoming increasingly challenging in today’s designs, interconnect is taking on a key role. In order to see how a particular interconnect solution will perform in our design, we really need hands-on evaluation of the technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about evaluation and development kits for high-speed interconnect solutions.
Click here for more information about Samtec Evaluation and Development Kits
0 to 112 (Gbps PAM4) in 5 Seconds – Samtec
With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.
Click here to download the Silicon-to-Silicon Solutions Guide