HPC. FinTech. Machine Learning. Network Acceleration. These and many other emerging applications are stressing data center networks. Data center architectures evolve to ensure optimal resource utilization and allocation. PECFF (PCIe® Enclosure Compatible Form Factor) was developed to optimize next-gen system design ...
There are some products that have become so familiar that their name has entered everyday language. The Hoover Company became so successful in the vacuum cleaner market that its name has entered the language to describe the task they perform. Here ...
In July we rolled out a major update to our Cart, added a few tweaks to the Video Search page, added several new training videos, and updated content in a variety of places. Here are the major website updates for July 2020. ...
You might remember the last blog on Immersion Cooling where we introduced Samtec’s new landing page for Immersion Cooling. The test results are in, and they look good. Samtec has partnered with Engineered Fluids to run a series of qualification ...
Samtec on Facebook
Samtec on Twitter
Samtec Chalk Talks
Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips — Samtec and Mouser Electronics
Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design.
Click here for more information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips
Evaluation and Development Kits — Samtec
With signal integrity becoming increasingly challenging in today’s designs, interconnect is taking on a key role. In order to see how a particular interconnect solution will perform in our design, we really need hands-on evaluation of the technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about evaluation and development kits for high-speed interconnect solutions.
Click here for more information about Samtec Evaluation and Development Kits
0 to 112 (Gbps PAM4) in 5 Seconds – Samtec
With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.
Click here to download the Silicon-to-Silicon Solutions Guide