BRUSSELS, BELGIUM (MARCH 10, 2026) – At the first Advanced Packaging International Conference, NHanced Semiconductors president Robert Patti will present a talk entitled “Foundry 2.0: A New Foundation For Semiconductors & Innovation” on April 21st as part of a series of expert talks at the event.
The AP Int’l program includes industry leaders and academic experts delivering technical presentations, panel discussions, a poster session, and numerous networking opportunities, providing comprehensive insights into how advanced packaging is enabling system-level semiconductor innovation.
“In the 1960s, Gordon Moore predicted a ‘day of reckoning’ for semiconductor scaling, and that day has arrived,” said Patti. “Advanced packaging provides a new path for semiconductor innovation that doesn’t rely on traditional scaling. At the core of this path is a new business model: ‘Foundry 2.0.’”
A preview of Patti’s presentation follows:
Paradigm shift in semiconductor manufacturing
For the past 50 years, the traditional semiconductor manufacturing business model – Foundry 1.0 – has focused on scaling smaller transistors on more densely-packed chips. However, each smaller node has faced higher development costs, higher capital costs, longer development times, expensive design tools, and high risk. The response to this situation has been a paradigm shift in this manufacturing model as the industry looks to advanced packaging to deliver better cost, performance, and SWaP parameters.
Foundry 2.0 represents a fundamental change for the industry
Foundry 2.0 brings together the best of advanced packaging technologies and material solutions by using the same interconnect and manufacturing methods typically used in building semiconductor devices themselves. The next generation of semiconductors will be developed through advanced packaging, additive silicon manufacturing, and true heterogeneous integration to achieve better ROI, lower development costs, and reduced capital expenditures.
About NHanced Semiconductors, Inc.
Based in the US, NHanced Semiconductors is the world’s first pure-play advanced packaging foundry, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, hybrid bonding, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.
Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing manufacturing, in-house process development, and customer prototyping, as well as a volume interposer and assembly facility in Odon, IN. For more information, please visit: https://nhanced-semi.com/
About the Advanced Packaging International Conference 2026
Advanced Packaging International is part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences. Bringing together multiple conferences, 800+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, Advanced Packaging International is the number one global event covering compound semiconductor, photonic integrated circuits, power electronics and packaging technologies. With a strong overlap between the conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.
