Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments.
Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial automation, and ruggedized edge computing. Its integrated controller handles wear leveling, bad block management, and error correction (ECC), ensuring long-term data integrity and simplified system integration.
“With eMMC continuing to serve as a foundational technology for embedded systems, we’re proud to offer a drop-in solution with long-term supply assurance and robust performance,” said Mont Taylor, Vice President of Business Development, at Teledyne HiRel. “This release supports our customers’ demand for reliable, off-the-shelf storage solutions that integrates easily into space-constrained, mission-critical systems.”
Available now, the module supports JEDEC-standard eMMC 5.1 commands, operates from a single 3.3V supply (I/O at 1.8V), and delivers sustained read/write speeds suitable for OS boot, data logging, and code storage. Its long-term availability helps ensure continuity and support across multi-year program lifecycles.
For more information on this device, please click here. To explore Teledyne HiRel’s full portfolio of semiconductors, converters, processors, and related services, visit the Teledyne HiRel Semiconductors website.
