[August 18, 2025 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON West held at Phoenix Convention Center, Phoenix, Arizona from October 7 – 9, 2025.
Visit TRI’s Booth No. 5581 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI’s Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.
TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the 3D SEMI AOI TR7700Q SII-S with AI-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI’s SEMI AXI solutions can inspect C4 bumps and Cu pillars.
Visit TRI’s Booth No. 5581 at SEMICON West 2025 to explore TRI’s SEMI solutions.
About Test Research, Inc. (TRI)
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.
