Arezzo, Italy – February 19, 2026– At Embedded World 2026 (March 10–12, Nuremberg), SECO will showcase a portfolio of MediaTek–based solutions, reinforcing its partnership and highlighting how their combined technologies enable advanced Edge AI across multiple verticals.
SOM-Trizeps-X-Genio360/360P: cost-efficient Edge AI SOMs based on MediaTek Genio 360 and pin-to-pin compatible Genio 360P
At Embedded World 2026, SECO will introduce SOM-Trizeps-X-Genio360/360P, expanding its Trizeps SODIMM System-on-Module family with a new-generation SOM based on the recently launched MediaTek Genio 360 and the pin-to-pin compatible Genio 360P IoT platform.
MediaTek Genio 360/360P are 6nm, value-tier IoT processors designed for cost-sensitive embedded applications, combining strong CPU performance with excellent power efficiency. They integrate an advanced MediaTek NPU delivering over 8 TOPS of AI performance, enabling on-device AI and Generative AI at the edge.
With support for 4K displays, camera interfaces, and rich industrial connectivity, SOM-Trizeps-X-Genio360/360P target advanced HMIs, mobile and handheld devices, smart appliances, and AI-enabled edge systems.
Built on this platform, SOM-Trizeps-X-Genio360/360P inherits the core strengths of the SECO Trizeps SODIMM family, designed for cost-sensitive industrial systems:
- Compact form factor: 67.6 mm × 36.7 mm
- Low-cost, robust SODIMM connector
- High level of long-term pin and software compatibility
- Typical power envelope below 5 W
- Industrial temperature range: –40°C to +85°C (industrial version)
As part of the MediaTek Genio 360/360P launch, Davide Catani, Chief Technology & Innovation Officer at SECO, will take part in the MediaTek press event on March 10, 2026. In addition, a dedicated talk will be hosted at the SECO booth (Hall 1, Booth 320) on March 11 from 11:00 to 11:30, featuring Sameer Sharma, AVP of the IoT BU from MediaTek, who will share further insights into the SECO–MediaTek partnership and its roadmap for next-generation Edge AI solutions.
“The launch of our new Genio 360–based SOM reflects the strength of our collaboration with MediaTek, enabling SECO to deliver cost- and power-efficient edge platforms that accelerate time-to-market for on-device AI,” said Davide Catani, Chief Technology & Innovation Officer at SECO.
“Continuing our storied partnership, we have been working closely with SECO to leverage the MediaTek Genio 360 and 360P for their upcoming SOM platforms,” said CK Wang, Vice President and General Manager of the IoT Business Unit at MediaTek. “Our chips offer a combination of benefits, including fantastic AI performance, premium connectivity and unparalleled power efficiency, which enables customers to develop a wide variety of products that will make a difference in the Industrial IoT market.”
Modular Vision Genio700: AI-powered industrial HMI in 10” and 15.6” formats
Modular Vision is SECO’s modular HMI product line designed to simplify the deployment of industrial-grade, AI-enabled human–machine interfaces. Built on a scalable hardware architecture and powered by Clea OS, Modular Vision combines computing performance, advanced graphics, and secure lifecycle management in a ready-to-integrate platform.
Within this portfolio, Modular Vision 15.6 Genio700 stands out as a high-performance HMI designed for AI-powered medical and intelligent applications. Based on MediaTek Genio 700, the solution integrates advanced multimedia and AI acceleration capabilities into a 15.6-inch industrial HMI, enabling local AI inference directly at the edge with no cloud dependency. Alongside Genio 700, SECO also offers Modular Vision solutions based on MediaTek Genio 510, providing an alternative option for applications requiring optimized performance and power efficiency across similar application domains.
At Embedded World 2026, the Modular Vision based on the Genio 700 processor will be showcased through a dedicated live experience presented at both the SECO booth and the MediaTek booth. Real-world medical automation scenarios running entirely at the edge will demonstrate how AI models for face recognition, voice command processing, and sample inspection can operate locally with ultra-low latency. Integrated with Clea, the demo also illustrates secure device management, data visualization, and lifecycle support within SECO’s end-to-end edge ecosystem.
SECO software stack for MediaTek-based edge AI
SECO’s MediaTek-based solutions are supported by a unified software stack that accelerates edge AI adoption, combining ready-to-deploy AI and IoT applications from the SECO Application Hub with centralized development resources from the SECO Developer Center. SECO’s end-to-end AI deployment pipeline integrates model optimization, secure deployment, and lifecycle management through the Clea software framework, enabling AI models to run locally on MediaTek platforms with low-latency inference, while updates and monitoring are managed centrally.
Visitors can experience SECO’s MediaTek-based edge AI solutions at Embedded World 2026 in Hall 1, Booth 320.
SECO
SECO (IOT.MI) is a high-tech company that develops and manufactures cutting-edge solutions for the digitalization of industrial products and processes. SECO’s hardware and software offerings enable B2B companies to easily introduce edge computing, Internet of Things, data analytics, and artificial intelligence to their businesses. SECO’s technology spans across multiple fields of application, serving more than 450 customers across sectors such as medical, industrial automation, fitness, vending, transportation, and many others. Through live monitoring and smart control of in-the-field devices, SECO solutions contribute to low environmental impact business operations via a more efficient use of resources. SECO provides the US and Canada with comprehensive engineering, technical support, and business services from its headquarters in Rockville, Maryland, United States.
