SAN JOSE, Calif.—Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for scalable interconnects in AI data centers, will showcase its latest advancements in e-Tube™ RF rack-scale data transmission over plastic waveguides at the upcoming Open Compute Project (OCP) Global Summit, held October 13–16 at the San Jose Convention Center. As an active contributor to OCP’s mission of open innovation, Point2 will present its vision for next-generation AI infrastructure through technical sessions and live demonstrations.
Point2’s patented e-Tube RF platform delivers a compelling alternative to copper and optics, offering 10× cable reach of copper at a similar cost structure, while 3× lower cost and power, and 1000× lower latency than traditional optical interconnect. At the heart of Point2’s showcase is its rapidly expanding e-Tube cable and connectorization ecosystem, developed in collaboration with Molex and Foxconn Interconnect Technology (FIT). This ecosystem enables seamless integration of e-Tube into standard data center architectures, accelerating deployment and scalability for hyperscale and enterprise AI clusters.
Key Use Cases to Be Highlighted at OCP:
- OSFP Pluggable Active RF Cable (ARC): Point2 will present the e-Tube ARC cable for intra-rack and cross-rack interconnects, offering plug-and-play compatibility with the MSA OSFP form factor.
- Rack-Scale Compute Fabric Interconnect: Point2 will showcase e-Tube as a transformative RF alternative to copper in backplanes, connecting GPU accelerators through the compute fabric for AI cluster scale-up.
“AI workloads are pushing the limits of conventional interconnect technologies,” said Dr. Sean Park, Co-Founder and CEO of Point2 Technology. “With e-Tube, we’re leaping past the copper cliff and avoiding the optical penalties to deliver a scalable, low-latency, energy-efficient interconnect platform. Our collaboration with Molex and FIT ensures that e-Tube will be ready for demanding rack-scale deployments.”
“FIT is excited to partner with Point2 to bring e-Tube technology into mainstream rack-level deployments,” said Julia Jiang, VP of Marketing and Sales at FIT. “Our joint efforts will help data center operators achieve higher performance and lower power consumption while simplifying interconnect architecture which can deliver copper-like reliability and economics to our customers.”
“Molex is proud to lead the innovation of high-performance connector and cable solutions that enable Point2’s e-Tube solutions to meet the demands of next-generation data centers,” said Chad Jameson, General Manager, I/O Solutions at Molex. “Together, we’re enabling highly reliable, scalable, and manufacturable AI interconnects for next-generation AI data centers.”
Point2 Technology will participate in the OCP Global Summit with a speaking session by Dr. Sean Park, a presence in the Innovation Village, and at a private suite at the Hilton San Jose where the company will showcase its latest technologies. Additional details are as follows:
Speaking Session
Title: “Leap Over the Copper Cliff and Avoid the Optical Penalties to Scale Up AI Clusters”
Speaker: Dr. Sean Park, Co-Founder & CEO of Point2 Technology
Date: Wednesday, October 15
Time: 1:55 – 2:15 PM PST
Location: SJCC – Concourse Level – 210ABEF
Live Demonstrations in the Innovation Village
Point2 will also demonstrate its ground-breaking e-Tube technology in the FTS Emerging Technology section of the Innovation Village on the OCP Exhibition floor. Attendees can witness live demos of e-Tube interconnects and engage directly with Point2’s leadership team.
Live Demonstrations at the Hilton San Jose Private Suite
Point2 will also host private meetings with demonstrations of its e-Tube ARC, AEC, and roadmap discussion. Contact sales.us@point2tech.com to schedule a meeting.
