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Samtec Si-Fly® LP, Low-Profile Cable Assemblies Capable of Residing Under IC Cooling Hardware

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces production quantity availability of Si-Fly LP low-profile cable assemblies. The extremely low 4.35 mm mated height … Read More → "Samtec Si-Fly® LP, Low-Profile Cable Assemblies Capable of Residing Under IC Cooling Hardware"

xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers – Delivers First In-Module Active Cooling for High-Performance Optical Transceivers

Santa Clara, CA – April 29, 2025 – xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry’s first in-module active thermal management solution to high-performance optical transceivers.

Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers — a critical yet underserved category in next-gen AI infrastructure.

Unlike conventional cooling approaches that … Read More → "xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers – Delivers First In-Module Active Cooling for High-Performance Optical Transceivers"

Semiconductor Manufacturers Solve Space, Power Challenges with PoE Enabled Panel PCs

Semiconductor manufacturing environments operate under strict regulatory and operational constraints that dictate every aspect of their design, including computing solutions. Unlike conventional production facilities, these spaces require sterile conditions, efficient workflows, and strict regulatory adherence, necessitating the careful optimization of every square inch. Computing systems must be compact, compliant, and seamlessly integrated into space-constrained environments.

These manufacturing facilities require highly specialized equipment for each stage of production, and the strategic placement of this equipment is critical to ensure compliance with cleanroom standards. Expanding these facilities is rarely an option, as cleanroom construction is … Read More → "Semiconductor Manufacturers Solve Space, Power Challenges with PoE Enabled Panel PCs"

MYIR Launches Two New Rockchip Series SOMs: MYC-YR3562 and MYC-YR3506

Shenzhen, China – March 20, 2025 – MYIR has expanded its Rockchip series System-On-Module (SOM) family with the release of two new modules, the MYC-YR3562 and MYC-YR3506. Based on Rockchip’s RK3562 and RK3506 processors, respectively, these SOMs deliver high performance and flexibility for a wide range of applications.

The Read More → "MYIR Launches Two New Rockchip Series SOMs: MYC-YR3562 and MYC-YR3506"

Smart Surfaces: A Powerless Solution to Multipath Signal Interference

Multipath interference disrupts wireless signals, causing issues like TV ghosting and fading. Now, researchers from Japan have developed a passive metasurface that overcomes traditional filtering limits. Using a time-varying interlocking mechanism with field-effect transistors, it transmits the first signal while blocking delayed ones from other angles—without power or processing. This innovation enables low-cost, reliable wireless communication, which is ideal for IoT applications and environments prone to interference.
The evolution of wireless communications and the miniaturization of electrical circuits have fundamentally reshaped our lives and the digital landscape. However, as we push toward higher-frequency communications … Read More → "Smart Surfaces: A Powerless Solution to Multipath Signal Interference"

Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications

CHANDLER, Ariz., April 28, 2025 — The rapid growth of artificial intelligence (AI) is transforming data centers, creating an unprecedented demand for high-performance, secure, reliable and innovative solutions. Microchip Technology (Nasdaq: MCHP) is addressing these evolving market needs by developing advanced technologies for data center connectivity, storage and data retrieval. Microchip’ … Read More → "Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications"

New CompacFrame Optimized for Rapid Development of Rugged AI-Focused Applications

FREMONT, Calif., April 2025 – Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version. Equipped with six 3U payload slots and one VITA 62 power supply slot, the new 3U OpenVPX test and development platform allows for SBC and GPU coupling and distribution directly through the backplane.

The CompacFrame was designed to meet the complex needs of AI-based processing when testing and developing rugged embedded applications. Typical applications include where one GPU/SBC pair is running an inference model and another is supporting signal processing of RF data … Read More → "New CompacFrame Optimized for Rapid Development of Rugged AI-Focused Applications"

Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design

CHANDLER, Ariz., April 23, 2025 — Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To address these demands, Microchip Technology (Nasdaq: MCHP) has released the PIC16F17576 microcontroller (MCU) product family with integrated low-power peripherals and the ability to precisely measure volatile analog signals.</ … Read More → "Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design"

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