News – Page 984 – EEJournal

Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems

5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market

February 27, 2019

CHANDLER, Ariz., February 26, 2019 — As firmware updates and larger media files become more prevalent in automotive entertainment consoles, faster data rates are required to reduce upload and download times. Microchip Technology Inc. (Nasdaq: MCHP) today announced an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal connectivity in vehicles, the Read More → "Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems"

Rohde & Schwarz showcases innovative 5G NR OTA device testing solutions at MWC 2019

February 27, 2019

5G NR technology will witness the adoption of new, complex technologies, such as beamforming, sophisticated antenna array systems and new usable communications spectrum, including mmWave. For mmWave, every device will have to be tested over the air (OTA), without any cable connections. To address these challenges, the T&M specialist Rohde & Schwarz has created industry-leading OTA test solutions that will be on display at Mobile World Congress in Barcelona.

Munich, February 25, 2019 — 5G NR provides numerous technological advantages, but there will also be many technical challenges that need to be overcome during 5G NR testing. Since … Read More → "Rohde & Schwarz showcases innovative 5G NR OTA device testing solutions at MWC 2019"

LDRA to Support MISRA C:2012 (3rd Edition, 1st Revision) and New Integrated MISRA/AUTOSAR C++ Guidelines

Support for the new language subsets to be key components of the LDRA tool suite for Automotive

February 27, 2019

Wirral, U.K. — 25 February 2019 — Read More → "LDRA to Support MISRA C:2012 (3rd Edition, 1st Revision) and New Integrated MISRA/AUTOSAR C++ Guidelines"

Newark element14 Introduces Avnet SmartEdge Industrial IoT Gateway: A Low-Cost Device for Industrial Applications

Demonstrated at Embedded World in Nuremberg, Germany, February 26-28

February 27, 2019

Chicago, February 26, 2019: Newark element14, the Development Distributor, introduced the exclusive Avnet SmartEdge Industrial IoT Gateway, a new low-cost industrial gateway powered by Raspberry Pi. The Avnet SmartEdge Industrial Gateway will be showcased at Embedded World in Nuremberg, Germany from February 26-28 in booth 1-370.

The Avnet SmartEdge Industrial IoT Gateway enables seamless and secure connectivity to the cloud through Avnet’s IoT Connect platform … Read More → "Newark element14 Introduces Avnet SmartEdge Industrial IoT Gateway: A Low-Cost Device for Industrial Applications"

Renesas Electronics’ New RZ/G2 64-Bit MPUs Deliver Industry- Leading Performance with Super Long-Term Linux Support

All Four RZ/G2 MPUs Deliver Secure and Reliable Operation with ECC on All Memories, and More Than 10 Years of Linux Kernel Support

February 27, 2019

Düsseldorf, February 21, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the RZ/G2 Group of 64-bit Arm® Cortex®-A57 and Cortex®-A53-based microprocessors (MPUs) for industrial automation and building automation applications, as the second generation of the RZ/G Series. The four new RZ/G2 MPUs are supported by the Renesas Read More →

Wind River to Showcase Edge Cloud Compute Applications at Mobile World Congress

February 27, 2019

ALAMEDA, Calif. – Feb. 20, 2019 – Wind River®, a leader in delivering IoT software to critical infrastructure, will be demonstrating edge cloud technologies with its partners from across the Wind River Titanium Cloud ecosystem at Mobile World Congress taking place February 26-28. Showcasing a variety of use cases, Wind River Titanium Cloud virtualization platform will be featured in demonstrations at partners’ booths.

Through the collaboration of industry-leading software and hardware companies, the Titanium Cloud ecosystem ensures the availability of interoperable standard products optimized for NFV deployment with Titanium Cloud to help accelerate time-to-market for service providers and telecom equipment manufacturers ( … Read More → "Wind River to Showcase Edge Cloud Compute Applications at Mobile World Congress"

MISRA C and the LDRA tool suite Selected to Ensure Safety in Power Wheelchair Head Control

NOW Technologies has chosen LDRArules for coding standards compliance under IEC 62304 functional safety standard

February 27, 2019

Wirral, U.K. – 21 February 2019 – Read More → "MISRA C and the LDRA tool suite Selected to Ensure Safety in Power Wheelchair Head Control"

Wind River Unveils Edge Platform to Accelerate the Evolution from Automated Devices to Autonomous Systems

February 27, 2019

NEWS HIGHLIGHTS
• Wind River introduces software platform for edge devices designed to enable the modernization of legacy systems in aerospace, automotive, defense, industrial, and medical.
• Wind River Helix Virtualization Platform brings together company’s proven technology and safety expertise for designing and implementing a range of application options at the edge.
• With latest innovative offering, company’s comprehensive edge compute software portfolio provides a path for the development journey from automated devices to more intelligent and autonomous systems.

ALAMEDA, CA – Feb. 26, 2019 – Wind River®, a leader in delivering software to critical infrastructure, today announced the … Read More → "Wind River Unveils Edge Platform to Accelerate the Evolution from Automated Devices to Autonomous Systems"

Nexperia announces industry’s smallest logic parts approved for automotive

Up to 64% smaller than leaded devices

February 26, 2019

Nijmegen, February 26, 2019: Nexperia, the global leader in discretes, logic and MOSFET devices, today announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.

Nexperia’s MicroPak packages feature the same silicon … Read More → "Nexperia announces industry’s smallest logic parts approved for automotive"

SamacSys and Altium deliver integrated platform for PCB footprints, schematic symbols and 3D models

SamacSys today announces a new Altium integration at embedded world 2019 in Nuremberg

February 26, 2019

Wallingford, UK and Nuremberg, Germany, 26 February 2019 – SamacSys Ltd, the world’s leading provider of electronic component CAD models, has completed a new integration with Altium, a leading supplier of PCB design tools. Announced today at the embedded world trade fair in Nuremberg, Germany, the collaboration will support Altium customers by directly integrating the SamacSys platform of free design resources, including PCB footprints, schematic symbols and 3D models for more than 15 million components.

“Being able to integrate our eCAD model platform within the Altium product range is an exciting development for us,” said Alex MacDougall, CEO at SamacSys. “ … Read More → "SamacSys and Altium deliver integrated platform for PCB footprints, schematic symbols and 3D models"