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New Vishay Intertechnology High Voltage Thick Film Chip Resistors Deliver Power to 1.5 W, Increased Design Flexibility

Devices Offer Voltages to 3000 V, Stability of < 0.5 % in Variety of Styles, Termination Materials, and Configurations
March 4, 2019

MALVERN, Pa. — March 4, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of high voltage thick film chip resistors that offer high power ratings up to 1.5 W and working voltages to 3000 V in five compact case sizes ranging from 1206 to 2512. For increased design flexibility, the Vishay Techno CRHP series is available in a variety of styles, termination materials, configurations, and custom sizes.

The devices announced today combine their high power and voltage ratings with outstanding stability of < 0.5 %. The resistors offer a wide resistance range from 2 MΩ to 50 GΩ, tolerances down to ± 0.5 %, and temperature coefficients of ± 100 … Read More → "New Vishay Intertechnology High Voltage Thick Film Chip Resistors Deliver Power to 1.5 W, Increased Design Flexibility"

Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution

Complete LPDDR5 IP Solution Includes Cadence PHY, Controller and Verification IP
March 4, 2019

SAN JOSE, Calif., March 4, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced early availability of the complete, silicon-proven Cadence® Denali® Gen2 IP for LPDDR5/4/4X in TSMC’s 7nm FinFET process technology. Offering up to 1.5X faster bandwidth than the fastest speed of LPDDR4 and LPDDR4X, the LPDDR5 standard enables high bandwidth with low power consumption, making it well suited for mobile computing, AI, IoT, cryptocurrency mining and automotive applications. The Cadence LPDDR5 IP solution consists of PHY, controller and Verification IP (VIP). For more information, please visit Read More → "Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution"

Pentek’s Jade Architecture Digital I/O XMC Module Now Available

March 4, 2019
  • 38 pairs of Configurable LVDS Digital I/O
  • Jade Architecture with Xilinx Kintex Ultrascale FPGA offers price,
    power and processing performance advantages
  • Navigator Design Suite expedites development and custom IP integration

UPPER SADDLE RIVER, NJ─March 4, 2019─Pentek, Inc., today introduced the newest member of the Jade™ family of data converter XMC modules. The Model 71810 is based on the < … Read More → "Pentek’s Jade Architecture Digital I/O XMC Module Now Available"

Industry’s first integrated quad- and dual-channel RF-sampling transceivers enable multiantenna wideband systems

TI transceivers simplify design while delivering the industry’s widest frequency range and smallest footprint for defense, and test and measurement applications
March 4, 2019

DALLAS (March 4, 2019) – Texas Instruments (TI) (NASDAQ:TXN) today introduced two new RF-sampling transceivers that are the first in the industry to integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip. With the industry’s widest frequency range, highest instantaneous bandwidth and 75 percent smaller design footprint than a discrete solution, the quad-channel AFE7444 and dual-channel AFE7422 transceivers help engineers more easily achieve multiantenna, direct RF sampling for radar, software defined radio and wireless 5G applications. For more information, see Read More → "Industry’s first integrated quad- and dual-channel RF-sampling transceivers enable multiantenna wideband systems"

CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab

Successful device connection and end-to-end IP connectivity achieved using the CEVA-Dragonfly NB2 3GPP Rel. 14 compliant test chip on Vodafone’s NB-IoT test network
March 1, 2019

BARCELONA, Spain – #MWC19 – February 26, 2019 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, announced today that it has successfully completed the first test trials of its CEVA-Dragonfly NB2 silicon at Vodafone’s IoT Future Lab in Düsseldorf, Germany. Using Vodafone’s open lab facilities which provide a realistic end-to-end live environment of the Narrowband-IoT technology, CEVA connected to the Vodafone NB-IoT network and demonstrated end-to-end IP connectivity with its CEVA-Dragonfly NB2 test chip running a 3GPP NB-IoT … Read More → "CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab"

Octasic’s New System-on-Chip DSPs are Optimized for Small Cells, Portable Base Stations and Specialized Handsets

OCT3032 low power SoCs provide the highest processing capacity per watt for small cell designs with 2G to 5G flexibility
March 1, 2019

MONTREAL, Canada, 26 February, 2019 – Octasic, the leader in low power wireless and media processing solutions, today announced its latest high performance System-on-Chip (SoC). Incorporating Opus3, Octasic’s third-generation digital signal processor (DSP) core architecture, the OCT3032 SoC is optimized to provide the highest processing capacity per watt for 2G to 5G small cells, network-in-a-box (NiB) applications, private wireless deployments, defense tactical … Read More → "Octasic’s New System-on-Chip DSPs are Optimized for Small Cells, Portable Base Stations and Specialized Handsets"

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

New IC is capable of 100mV cold start, with extended input voltage range
March 1, 2019

February 26th, 2019 – Mont-Saint-Guibert, Belgium: e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application.

Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology that is capable of extracting available input current up to levels of 110mA. Taking DC power from a connected thermal electric generator (TEG), it can supervise the storing of energy in a rechargeable element and simultaneously supply energy to the system via 2 different regulated voltages. This is done through its built-in low … Read More → "e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting"

Offering state of the art RF integration with a combined Bluetooth Low Energy and LoRa Combo module with dual integrated antennas

February 28, 2019

Sophia Antipolis, France, 26 February 2019 – Following on from the success of its class leading range of Bluetooth Low Energy (BLE) modules, Insight SiP, the specialist in ultra-miniature RF modules, is launching the ISP4520 series of modules, extending its product portfolio to include Long Range Networking via LoRa technology.

The ISP4520 module integrates BLE and LoRa radio functionality to offer a unique solution, combining the short-range high throughput capability and easy smartphone/PC access of BLE together with the long-range features of LoRa technology. The module uses Insight SiP’s patented “Antenna in Package” technology … Read More → "Offering state of the art RF integration with a combined Bluetooth Low Energy and LoRa Combo module with dual integrated antennas"

Keysight and MediaTek Demonstrate 5G NR Data Call Using Helio M70 Multi-Mode Modem with Integrated Baseband

Keysight’s 5G network emulation solutions key to successful demonstration of enhanced mobile broadband applications using MediaTek’s Helio M70
February 28, 2019

SANTA ROSA, Calif., February 22, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, today announced the industry’s first successful demonstration of a 5G New Radio (NR) IP data transfer call using MediaTek’s Helio M70 Multi-Mode Modem with integrated baseband.

The demonstration used Read More → "Keysight and MediaTek Demonstrate 5G NR Data Call Using Helio M70 Multi-Mode Modem with Integrated Baseband"

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