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Saelig Debuts Siglent SHA860A Handheld Signal Analyzers for 5G NR

The Siglent SHA860A analyzers can analyze signals from 9 kHz to 7.5 GHz, with multiple optional features, at an economical price-point
April 30, 2025

Fairport, NY. Saelig Company, Inc. has introduced the Siglent SHA860A Series Real-time Handheld Signal Analyzers, which broadens SIGLENT’s handheld analysis capabilities with extended bandwidth real-time and modulation analysis. The SHA860A series can handle frequencies up to 7.5GHz with 110MHz of real-time bandwidth. This enables 5G NR and LTE measurements with a 100% probability of intercept time of just 3.51us. Cable test, network analysis, advanced measurements as well as analog and digital demodulation and IQ acquisition capabilities can also be added. The analyzer is easily controlled from an 8.4” multi-touch screen, mouse and keyboard.

Read More → "Saelig Debuts Siglent SHA860A Handheld Signal Analyzers for 5G NR"

Imec coordinates EU Chips Design Platform

Consortium to facilitate access to design infrastructure, training, and capital for European fabless semiconductor startups, small and medium enterprises and research organizations
April 30, 2025

LEUVEN (Belgium), 29 April, 2025 — A consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform. Funded by Chips JU, the platform will facilitate access to advanced semiconductor design infrastructure, training, and capital for fabless semiconductor startups, small and medium enterprises and research organizations. By providing the necessary resources, the initiative aims to democratize and foster semiconductor innovation across Europe, specifically for chip design.

The semiconductor industry is the backbone of modern technology, powering everything … Read More → "Imec coordinates EU Chips Design Platform"

Seamless Integration of Handheld Radios for RoIP & Unified Communications Featured at Modern Day Marine

New PacStar Modular Radio Chassis and brackets ease and speed integration of tactical radio ecosystems, enabling any echelon to quickly and easily deploy at the tactical edge
April 30, 2025
MODERN DAY MARINE – Washington, D.C. (Booth #1613) – April 29, 2025 – Curtiss-Wright’s Read More → "Seamless Integration of Handheld Radios for RoIP & Unified Communications Featured at Modern Day Marine"

VSORA Raises $46 Million to Bring World’s Most Powerful AI Inference Chip to Market

April 29, 2025
  • Europe’s only provider of more powerful, energy-efficient and cost-effective AI Chips than other solutions from global market leaders
  • Funding will enable VSORA to produce its cutting-edge AI chip in 2025

PARIS––April 29, 2025––VSORA, a French innovator and the only European provider of ultra-high-performance artificial intelligence (AI) inference chips, today announced that it has successfully raised $46 million in a new fundraising round. 

Read More → "VSORA Raises $46 Million to Bring World’s Most Powerful AI Inference Chip to Market"

Siemens and Intel Foundry advance collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC

April 29, 2025

Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging. Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and compelling  solution for 3D IC and chiplet offerings to a breadth of semiconductor market verticals.

Intel 18A Certification Achievements

Siemens’ industry-leading Calibre® nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit ( … Read More → "Siemens and Intel Foundry advance collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC"

Infineon launches CoolSiC™ MOSFET 750 V G2 with ultra-low RDS(on) for automotive and industrial power electronics

April 29, 2025

Munich, Germany – 29 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launched its new CoolSiC™ MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications. The CoolSiC MOSFETs 750 V G2 technology offers a granular portfolio with typical R DS(on) values up to 60 mΩ at 25°C, making it suitable for a wide range of applications, including on-board chargers (OBCs), DC-DC converters, auxiliaries for electric vehicles (xEVs) as well as industrial applications in EV charging, solar inverter, energy storage systems, telecom … Read More → "Infineon launches CoolSiC™ MOSFET 750 V G2 with ultra-low RDS(on) for automotive and industrial power electronics"

Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies

Synopsys Production-Ready EDA Flows and Broadest IP Portfolio Deliver Leading PPA for Intel Foundry's Advanced Processes and Packaging Technologies
April 29, 2025

Highlights

  • Production-ready Synopsys digital and analog EDA flows for Intel 18A and Intel 18A-P technologies pave the way for broad adoption and accelerate development of high-performance designs; engaged in early design technology co-optimization for Intel 14A-E
  • Optimized EDA reference flow with a unified exploration-to-signoff platform accelerates 2.5D/3D multi-die designs for Intel’s EMIB-T advanced packaging technology
  • Broadest portfolio of high-performance and low-power IP for Intel 18A and expanded Synopsys IP support for Intel 18A-P offers customers faster time-to-tapeout
  • Announcing membership in Intel Foundry Accelerator Design … Read More → "Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies"

Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry

Program will Invest in Cutting-Edge Equipment to Further Technology, Workforce and Ecosystem Development in Microelectronics
April 29, 2025

BOSTON, Mass. – The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) launched the SCALE Capital program, a $10 million grant initiative to advance microelectronics capability, training and product development across Massachusetts.

The SCALE Capital Program, also known as the Supporting Chip Advancement from Lab to Enterprise Capital Program, provides funding to help organizations purchase cutting-edge equipment for microelectronics projects. Eligible entities in the program include a range of organizations, from higher education institutions to … Read More → "Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry"

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