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Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology

SAN JOSE, Calif., 13 May 2019

Highlights:

  • Samsung and Cadence collaborate to enable an integrated flow for designing automotive, IoT and AI applications at 28nm FD-SOI node
  • Samsung’s 28FD-SOI PDK techfile is Mixed-Signal OpenAccess ready, enabling customers to deploy OpenAccess-integrated, fully interoperable Virtuoso-Innovus implementation flows

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design flow has achieved certification for Samsung Foundry’s 28nm FD-SOI (28FDS) process technology. This certification ensures … Read More → "Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology"

Newark Expands Range of Test and Measurement Products with GW Instek Test Instruments

Chicago, May 15, 2019: Newark, the Development Distributor, has further expanded the breadth and depth of its product portfolio by adding the GW Instek test & measurement instruments to its range. The products, which include programmable power supplies, electrical safety testers, signal sources and power analyzers, offer customers excellent quality at an affordable cost.

Key GW Instek products to be stocked by … Read More → "Newark Expands Range of Test and Measurement Products with GW Instek Test Instruments"

Siemens introduces revolutionary new validation program to accelerate autonomous vehicle development

Siemens today introduced the PAVE360™ pre-silicon autonomous validation environment — a program established to enable and accelerate the development of innovative autonomous vehicle platforms. PAVE360 provides a comprehensive environment for multi-supplier collaboration across the automotive ecosystem for the development of next-generation automotive chips. PAVE360 also extends digital twin simulation beyond processors to include automotive hardware and software sub-systems, full vehicle models, fusion of sensor data, traffic flows and even the simulation of smart cities through which self-driving cars will ultimately travel.

“PAVE360 represents the first output of an innovation process born from the combination … Read More → "Siemens introduces revolutionary new validation program to accelerate autonomous vehicle development"

XP Power announces new low profile 180W U-channel PSU for space-critical medical (BF), industrial & ITE applications

May, 15th 2019 – XP Power has launched a new range of 180-Watt U-channel AC-DC power supplies that are intended for space-constrained medical (BF), industrial and IT applications. The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection) of isolation while delivering up to 94% efficiency.

The UCP180 series PSUs have an integrated 12V, 500mA fan output, eliminating the need for any external driver circuitry. When used in conjunction with a … Read More → "XP Power announces new low profile 180W U-channel PSU for space-critical medical (BF), industrial & ITE applications"

Thirdwayv Announces the AppAuth ™ Cybersecurity Software Platform for Mission-Critical IoT Systems

Irvine, Calif., and IoT World Conference & Expo 2019, May 13, 2019 – Thirdwayv, a leading provider of end-to-end connectivity and security solutions for IoT applications, today announced it has added AppAuth ™ software to its growing suite of patented products that provide essential layers of security-by-design protection in a wide variety of mission-critical commercial and enterprise Internet of Thing (IoT) applications. Consisting of three software modules that bring trust … Read More → "Thirdwayv Announces the AppAuth ™ Cybersecurity Software Platform for Mission-Critical IoT Systems"

New Horizontal-Mount OpenVPX Chassis Platforms from Pixus Technologies

Waterloo, Ontario —May 15, 2019  –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced new OpenVPX enclosures that allow boards to be mounted horizontally.   The horizontal loading approach saves rack height for small slot count systems. 

The first in the series of EUR19VPX OpenVPX horizontal-mount chassis platforms from Pixus Technologies is a 2U high enclosure.  The design allows dual 6U boards, quad 3U boards, or a hybrid mix to be utilized in the chassis.   The cooling is achieved via a front-to-rear airflow … Read More → "New Horizontal-Mount OpenVPX Chassis Platforms from Pixus Technologies"

Microchip Expands Carrier-Grade Time and Synchronization Portfolio to Solve Network Deployment, Reliability and Scalability Challenges

CHANDLER, Ariz., May 15, 2019 — One of the biggest 5G network deployment challenges is synchronizing higher volumes of more densely packed base stations. Another is keeping services operating through Global Navigation Satellite System (GNSS) lapses due to vulnerabilities such as jamming, spoofing or loss of signal. Microchip Technology Inc. (Nasdaq: MCHP), via its Microsemi subsidiary, is solving these and other challenges for networks with additions to its Precision Time Protocol (PTP) PackeTime® portfolio including the Read More → "Microchip Expands Carrier-Grade Time and Synchronization Portfolio to Solve Network Deployment, Reliability and Scalability Challenges"

New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets

SAN JOSE, Calif., May 15, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded the high end of its popular Tensilica® Vision DSP product family with the introduction of the Cadence® Tensilica Vision Q7 DSP delivering up to 1.82 tera operations per second (TOPS). To address the increasing computational requirements for embedded vision and AI applications, the sixth-generation Vision Q7 DSP provides up to 2X greater AI and floating-point performance in the same area compared to its predecessor, the Vision Q6 DSP. The Vision Q7 DSP is specifically optimized for simultaneous localization and mapping (SLAM), a technique commonly used in the robotics, … Read More → "New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets"

VadaTech Announces New 6U VPX, Optical Amplifier/Splitter

Henderson, NV – May 10, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX981. The VPX981 is an optical amplifier/splitter module for use in 6U OpenVPX platforms requiring signal distribution over fiber (VTX350 as an example). An optical signal received from front-panel LC1 is amplified then split to provide 92 outputs (90 to the rear via MT ferrules and 2 to the front via LC UPC connectors).  Fiber output to the backplane is via VITA 66.1 connectors, a high-density, blind-mate optical interconnect.

Power matching between outputs is within +/- 1dB … Read More → "VadaTech Announces New 6U VPX, Optical Amplifier/Splitter"

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