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Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization

Breakthrough Technology Redefines Design Signoff by Leveraging Industry's Golden Timing Signoff and Machine Learning Technology to Accelerate Statistical Yield Analysis
May 30, 2019

MOUNTAIN VIEW, Calif., May 28, 2019 /PRNewswire/ —

Highlights:

The Zigbee Alliance Announces the ‘All Hubs Initiative’ Driven by Leading Ecosystems to Strengthen Interoperability, Reliability, and Security Across the IoT

Leading Tech Brands Come Together Within the Zigbee Alliance to Make Zigbee the Best Path for Industry-Wide Smart Home Interoperability
May 30, 2019

DAVIS, California – May 29, 2019 – The Zigbee Alliance today publicly announced a major ongoing initiative to make smart home and IoT products easier to develop, deploy, and sell across ecosystems. The “All Hubs Initiative” is driven by a Zigbee Alliance workgroup comprised of leading IoT companies including Amazon, Read More → "The Zigbee Alliance Announces the ‘All Hubs Initiative’ Driven by Leading Ecosystems to Strengthen Interoperability, Reliability, and Security Across the IoT"

STMicroelectronics Joins Car Connectivity Consortium

Top supplier to Smartphone and Automotive markets supports increased convenience, safety, and security at the intersection of two vital markets
May 30, 2019

Geneva, Switzerland, May 24, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced having joined the Car Connectivity Consortium (CCC), a cross-industry organization advancing global technologies for smartphone-to-car connectivity solutions.

“Smartphones have become productivity and convenience extensions of busy professionals and consumers—whether as voice-activated personal assistants, personal wallets, or as navigators—and they are a natural and safe appliance to ID and unlock doors for the owner, adjust the seat, tune the radio, and personalize the car for their comfort and preference,” said … Read More → "STMicroelectronics Joins Car Connectivity Consortium"

OmniVision and Fullhan Announce Joint RGB-IR Solution for Automotive Cabin Monitoring Systems in Mainstream Vehicles

Solution Fine Tunes Industry’s Smallest and Best Value 2MP RGB-IR Automotive Image Sensor for Optimal Performance With Low Light, Cost Effective Image Signal Processor
May 30, 2019

SANTA CLARA, Calif. – May 28, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, and Fullhan Microelectronics, a provider of chips and solutions for video surveillance products, today announced a joint solution for capturing and processing high quality color (RGB) and infrared (IR) automotive interior images, day and night, with a single camera.

This solution combines OmniVision’s OV2778 2MP RGB-Ir image sensor, which offers the industry’s best value with high sensitivity across all lighting conditions with Fullhan’s FH8310 image signal processor (ISP), which provides dedicated hardware for processing the … Read More → "OmniVision and Fullhan Announce Joint RGB-IR Solution for Automotive Cabin Monitoring Systems in Mainstream Vehicles"

Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU

May 30, 2019

Highlights:

•       Cadence delivers 7nm RAK for the development of Arm-based designs for next-generation smartphones, laptops, and other mobile devices
•       RAK provides an RTL-to-GDS flow, enabling designers to get to market faster using Arm IP

SAN JOSE, Calif., May 28, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full-flow digital and signoff tools support the new high-performance, high-efficiency Arm® Cortex®-A77 CPU for next-generation smartphones, laptops, and other mobile devices. To accelerate the adoption of Arm’s latest processor, Cadence delivered a complete 7nm Rapid Adoption Kit (RAK) that utilizes Arm 7nm POP IP … Read More → "Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU"

Flex Power Modules announces encapsulated sixteenth-brick DC-DC converters for industrial/railway and telecom applications

May 30, 2019
  • Encapsulated sixteenth-brick package for harsh environments
    9 to 36V and 18 to 75V inputs ideal for industrial/railway and telecom applications
    Output up to 50W, with 3.3V, 5V, 12V, 15V and 24V outputs available
    High efficiency of up to 91%

    Flex Power Modules introduces the PKU-S series of DC-DC power modules for the industrial/railway and telecom sectors, to provide highly reliable, high performance and rugged DC-DC solutions.

    The modules are housed in the industry-standard sixteenth-brick form factor (35.3 x 25 x 10.4mm / 1.39 x 0.984 x 0.41 in), with sealed and encapsulated packaging. This ensures their reliability when … Read More → "Flex Power Modules announces encapsulated sixteenth-brick DC-DC converters for industrial/railway and telecom applications"

New 6U VITA 66/67 Hybrid Development Chassis From Pixus Technologies

May 29, 2019

Waterloo, Ontario  —  May 23, 2019 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a 6U OpenVPX chassis platform with a mix of VITA 66.4 optical connectors and VITA 67.3 RF connectors. 

The open frame chassis features a 6-slot 6U OpenVPX backplane with the RF and optical connector cutouts.  The specialty connectors can optionally be installed by Pixus.  The OpenVPX connectors are pass-through for versatility in development.  The backplane can be loaded to various requirements, with slots positions populated/unpopulated as needed.  There … Read More → "New 6U VITA 66/67 Hybrid Development Chassis From Pixus Technologies"

Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm’s Latest Premium Mobile Processors

Synopsys Design and Verification Platforms and DesignWare Interface IP Enable Optimized PPA and Faster Time-to-Market for Smartphones, Laptops, and Other Mobile Devices
May 29, 2019

MOUNTAIN VIEW, Calif., May 26, 2019 /PRNewswire/ —

Highlights:

Pentek Enhances Navigator Design Suite for the RFSoC Quartz Architecture

May 29, 2019
  • Advanced FPGA development tools for RF and microwave applications
    New capabilities support the Xilinx Zynq UltraScale+ RFSoC
    Navigator Design Suite speeds development and custom IP integration

    BOSTON─June 4, 2019, International Microwave Symposium─Pentek, Inc., today introduced several enhancements to its Navigator Design Suite for the Xilinx Zynq UltraScale+ RFSoC. New IP expands Pentek’s existing IP library to over 140 cores for FPGA development on its Quartz Architecture platform. Pentek’s Navigator Design Suite includes the Navigator FDK (FPGA Design Kit) for integrating custom IP into Pentek factory-shipped designs and the Navigator BSP (Board Support Package) … Read More → "Pentek Enhances Navigator Design Suite for the RFSoC Quartz Architecture"

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