July 23, 2019 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces the latest issue of its Read More → "Mouser Electronics’ Newest Methods Technology eZine Explores the Arrival of 5G"
LONDON, UK, 23 July 2019 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, today announced it is shipping the latest version of the MakerBot 3D printer – the MakerBot Method (https://uk.rs-online.com/web/
Geneva, July 23, 2019 — The STLINK-V3MINI probe, new from STMicroelectronics, combines the enhanced features of STLINK-V3SET with standalone simplicity for faster programming and ease of use, for an even more affordable price, at just $9.75.
The compact, portable probe can be used anywhere to upload and debug applications on STM32* microcontrollers. It leverages ST’s 14-pin STDC14 debug cable to support enhanced features including Virtual COM Port (VCP). VCP brings extra convenience and flexibility, such as easily observing runtime data on the host PC for faster, clearer debugging.
Mass-storage support is another feature of STLINK-V3MINI … Read More → "Compact, Convenient, STLINK-V3MINI Debug Probe from STMicroelectronics Accelerates STM32 Application Development"
SANTA CLARA, July 23, 2019 – SiTime Corporation, a market leader in MEMS timing, today unveiled its Endura™ MEMS timing solutions for Read More → "SiTime’s Endura Timing Solutions for Aerospace and Defense – A Standout in Ruggedized Performance"
TOKYO, Japan, July 23, 2019 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced three new 15 Mbps photocouplers designed to withstand the harsh operating environments of industrial and factory automation equipment. The trend toward higher voltage, compact systems is driving stricter International safety standards and eco-friendly solutions that require smaller ICs with lower power consumption. The RV1S9x60A family meets this need with best-in-class low threshold input current (IFHL) ratings: the RV1S9160A (SO5) operates at 2.0mA, the RV1S9060A (LSO5) at 2.2mA, and the RV1S9960A (LSDIP8) at 3.8mA.</ … Read More → "Renesas Electronics Introduces Family of 15 Mbps Photocouplers with Industry Leading Features for Harsh Industrial Applications"
San Diego, CA, July 17, 2019 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – today announced 10 new COM Express Type 6 modules featuring the best and latest Intel embedded processor technology. The four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors are all based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables congatec to provide all 10 new processors on one COM Express module design – the conga-TS370. A total of 14 processor module variants are now available on this single microarchitecture, offering extremely wide scalability. The spearhead in terms of computing … Read More → "congatec presents 10 new high-end modules for embedded edge computing"
MOUNTAIN VIEW, Calif. and SANTA ROSA, Calif., July 18, 2019 /PRNewswire/ —
Highlights:
July 19, 2019 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Read More → "Now at Mouser: TI’s LMG1210 MOSFET and GaN FET Driver for High-Frequency Applications"
SAN JOSE, Calif., July 18, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today unveiled the Cadence® Conformal® Litmus, the next-generation solution that provides constraints signoff and clock domain crossing (CDC) signoff, reducing overall design cycle times and enhancing the quality of silicon in complex system-on-chip (SoC) designs. The Conformal Litmus provides designers with 100% signoff timer accuracy and up to 10X faster turnaround time versus the previous generation solution. For more information on the Cadence Conformal Litmus, please visit Read More → "Cadence Introduces Conformal Litmus to Deliver Fastest Path to Full-Chip Constraints and CDC Signoff"
Munich, Germany, 22 July, 2019 – Traveling at the speed of sound? The inventors of the Hyperloop believe that this will be possible someday. We would then travel in pods through a tube in a partial vacuum at speeds of up to 1,200 kilometers per hour. Engineers around the world are working on the technology.
During the night from Sunday to Monday, students from the Technical University of Munich (TUM) once again won the SpaceX Hyperloop Pod Competition near Los Angeles, a speed competition for pod prototypes. Equipped with more than 420 Infineon chips, the pod reached 463.5 km/h. This speed would … Read More → "Hyperloop contest: Infineon chips accelerate Technical University of Munich’s pod to fourth win in a row"
