MOUNTAIN VIEW, Calif., Sept. 18, 2019 /PRNewswire/ — Read More → "Synopsys Releases BSIMM10 Study Highlighting Impact of DevOps on Software Security"
Waterloo, Ontario — Sept 17, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new RiCool chassis configurations for 9-slot and 16-slot OpenVPX backplanes in the 6U height.
The RiCool OpenVPX chassis platform line from Pixus provides powerful and reliable cooling for high-CFM requirements. The front-to-rear cooled 9U tall enclosure pulls air from an intake area below the card cage and blows the heat ninety degrees out the rear. The dual fans are hot swappable and … Read More → "RiCool Chassis Platform from Pixus Technologies Features 9-slot or 16-slot OpenVPX 6U Backplanes"
Premstaetten, Austria (16 September, 2019) — ams (
The TMD2635 module from … Read More → "Launch of world’s smallest digital IR proximity sensing module paves way to smaller, lighter, always-available earbuds"
FACE Technology Interchange Meeting (TIM), Dayton, Ohio, September 17, 2019: Core Avionics & Industrial Inc. (“CoreAVI”) announced today the release of its new rugged SBC0003 COTS 3U VPX NXP® LX2160-based Single Board Computer hardware design IP with Arm architecture. CoreAVI’s COTS-D product line, part of CoreAVI’s Platforms for Safety Critical Applications (PSCA), enables customers with IP, including design source files and required DO-254 certification evidence, to allow them to immediately manufacture and certify SBCs and graphics modules. The SBC0003’s low powered, high performance characteristics offer an evolution from the last family of Power Architecture processors to new … Read More → "Core Avionics & Industrial Inc. Announces Industry’s First Single Board Computer Hardware IP Based on NXP LX2160 and Arm that is Designed for DO-254 DAL A Certification and Aligned with the Latest SOSA and HOST Standards"
SAN JOSE, CALIF –– September 17, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today announced its Design IP for the Ethernet Time-Sensitive Networking (TSN) protocol, an update to the IEEE standard for time-sensitive transmission of data over Ethernet networks.
“The traditional Ethernet protocol was designed to deliver data reliably but not to a specific time standard,” remarks Deepak Kumar Tala, managing director of SmartDV. For safety … Read More → "SmartDV Announces Availability of Ethernet TSN Design IP"
Carlton, VIC, … Read More → "Sensera Partners with Autodesk to Exhibit 3D IoT Positioning Solution"
SAN JOSE, Calif., 17 Sep 2019
Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with … Read More → "Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis"
D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today introduced TrueMask® ILT, a GPU-accelerated hardware and software system that enables IC manufacturers to implement stitchless, full-chip inverse lithography technology (ILT) for advanced-node designs in a single day. TrueMask ILT is a holistically conceived, purpose-built system with every component — including hardware, software, models, visualization and verification — designed and optimized for ILT. This system employs a unique GPU-accelerated approach that emulates a single, giant GPU/CPU pair that can compute an entire full-chip ILT solution at once. The result is a breakthrough in computational performance that finally makes full-chip … Read More → "D2S Enables “Stitchless” Full-Chip Inverse Lithography Technology in a Single Day for The Multi-Beam Era"
