News – Page 903 – EEJournal

Abaco Announces Industry’s First 6U VPX Solution to Feature new Xilinx RF System-on-Chip Technology

November 7, 2019

New RFSoC platform is aligned with SOSA standard
Very high density with 16 analog/digital and 16 digital/analog synchronized channels
Reduces slot count by one fourth for comparable performance

HUNTSVILLE, Ala.— November 5 2019 Abaco Systems today announced the industry’s first 6U VPX implementation of the transformational Xilinx® 16×16 RF system-on-chip (RFSoC) technology combined with the Xilinx Ultrascale+™ FPGA with High Bandwidth Memory (HBM). The < … Read More → "Abaco Announces Industry’s First 6U VPX Solution to Feature new Xilinx RF System-on-Chip Technology"

ennomotive and Grupo Antolin launch the second wave of technological challenges of the ANTOLIN i.JUMP open innovation program

They are looking for technical solutions that improve life on board the vehicle regarding the cooling of the cabin, product traceability, and interior lighting.

November 7, 2019

Madrid, 4th of November, 2019. Ennomotive and Grupo Antolin, one of the largest manufacturers of vehicle interiors in the world, launch the second wave of challenges of the ANTOLIN i.JUMP open innovation program. With this program, Grupo Antolin aims to develop innovative solutions to lead the transformation of the automotive industry, following the trends of the electric and connected vehicle and the digitalization of the processes.

To accomplish this, three new technological challenges have been launched.

The first challenge < … Read More → "ennomotive and Grupo Antolin launch the second wave of technological challenges of the ANTOLIN i.JUMP open innovation program"

VadaTech Announces Network Attached Storage Blade with RAID and iSCSI

November 7, 2019

Henderson, NV – November 6, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the ATC605. The ATC605 is a Network Attached Storage Blade incorporating on-board Intel Xeon E3-1505M and a high-performance hardware off-load engine for iSCSI Target supporting line rate at 40GbE. The … Read More → "VadaTech Announces Network Attached Storage Blade with RAID and iSCSI"

Rohde & Schwarz together with Fraunhofer Institutes HHI and IAF join forces in researching 6G at THz frequencies

November 7, 2019

While the new 5G technology is at the first stages of rollout, Rohde & Schwarz, the Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI and the Fraunhofer Institute for Applied Solid State Physics IAF are taking a step further with demonstrations in the terahertz (THz) frequency band, related to the 6th generation wireless mobile communication (6G). The collaboration has resulted in a wireless transmit and receive system operating between 270 and 320 GHz, with further frequency extensions for potential 6G bands already in preparation.

Munich, November 6, 2019 — 6G research is already underway in industry and academia. While 5G introduces mmWave … Read More → "Rohde & Schwarz together with Fraunhofer Institutes HHI and IAF join forces in researching 6G at THz frequencies"

Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis

November 7, 2019

Highlights:

• Industry’s first integrated power integrity solution combines STA with power analysis for more reliable, comprehensive signoff at 7nm and below
• Reduces IR drop margins to improve power and area without sacrificing signoff quality in advanced-node, low-voltage designs
• Utilizes proprietary vectorless-based algorithm to catch worst-case power switching events, improving the reliability of IR drop analysis without increased runtime
• Enables users to identify and automatically fix real silicon failures before committing to tapeout

SAN JOSE, Calif., November 6, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Tempus Power Integrity Solution, the industry’ … Read More → "Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis"

Maxim Provides Industry’s First and Only Automotive-Grade Secure Authenticator to Enhance Vehicle Safety

DS28C40 improves automotive reliability and data integrity by verifying genuine component use in ADAS, EV batteries and other electronic systems

November 6, 2019

SAN JOSE, Calif.—Oct. 31, 2019—Designers can now enhance safety, security and data integrity for connected vehicle systems while also reducing both complexity and code development time with the DS28C40 DeepCover® automotive secure authenticator from Maxim Integrated Products, Inc. (NASDAQ: MXIM). As the industry’s first and only AEC-Q100 Grade 1 solution for automotive systems, this authenticator IC reduces the design complexity and software vulnerability of current approaches to ensure only genuine components are used for many electronic systems, such as advanced driver assistance systems (ADAS) and electric vehicle (EV) batteries.

For … Read More → "Maxim Provides Industry’s First and Only Automotive-Grade Secure Authenticator to Enhance Vehicle Safety"

Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions

Renesas Microcontroller Technology and Altair Cellular IoT Technology Bring Best-in-Class Solutions to the Cellular IoT Market

November 6, 2019

TOKYO, Japan and HOD HASHARON, Israel – November 5, 2019 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Altair Semiconductor (Read More →

PCIe Packet Switches from Diodes Incorporated Meet Automotive Demands for Advanced Features

November 6, 2019

Plano, Texas November 5, 2019 Diodes Incorporated (Nasdaq: DIOD) today announced the PI7C9X2G304EVQ and Read More →

GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

Next generation high bandwidth memory solution based on GF’s most advanced FinFET platform aims to deliver capacity, speed and power for cloud based AI Applications

November 6, 2019

Santa Clara Calif. and Hsinchu, Taiwan, November 5, 2019 – GLOBALFOUNDRIES® (GF®) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF’s recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) … Read More → "GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications"

Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools

Revolutionary, High-Performance Optima Safety Platform Propels Range of High-Coverage Safety Solutions for Automotive ISO 26262 Fault Analysis

November 6, 2019

NAZARETH, ISRAEL – October 29, 2019 – Optima Design Automation a provider of advanced, unique semiconductor safety verification solutions based on a revolutionary, new fault analysis technology platform, launched today at the DVCon Europe event in Munich. Optima enables dramatic improvements in semiconductor safety verification time and coverage for safety-critical applications such as automotive semiconductor devices.

Optima also announced the commercial release of its Optima Safety Platform with an initial range of automated solutions for hard-error (permanent) and soft-error (transient) fault analysis, coverage maximization and structural analysis. Based on 27 person-years of development, the Optima Safety Platform is already in evaluation at … Read More → "Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools"