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Concurrent Technologies announce an Artificial Intelligence Accelerator Board

Rugged 3U VPX Accelerator Engine
January 28, 2020

Concurrent Technologies announce their first, high performance 3U VPX accelerator engine based on an Intel® Altera® FPGA.  TR AEx/3sd-RCx is focussed around Inference at the Edge applications such as real-time object recognition and behaviour monitoring.  It has been designed to work in parallel with Concurrent Technologies processor boards likeTR H4x/3sd-RCx and TR J4x/6sd-RCx that are in alignment with a proposed SOSA™ Technical Standard. 

The application of Artificial Intelligence (AI) … Read More → "Concurrent Technologies announce an Artificial Intelligence Accelerator Board"

Vishay Intertechnology Launches Integrated RGBC-IR Color Sensors With I²C Interface in Low Profile Packages

New Sensors Feature 16-Bit Resolution for Higher Sensitivity and Linearity
January 28, 2020

MALVERN, Pa. — Jan. 27, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today broadens its optoelectronics portfolio with new RGBC-IR sensors for applications such as automatic white balancing and color cast correction in digital cameras; automatic LCD backlight adjustment; and active monitoring of LED color output for IoT and smart lighting. The new VEML3328 (top-looking) and VEML3328SL (side-looking) sensors offer better linearity and higher sensitivity compared to previous generation devices, as well as new features including an infrared (IR) channel.

The sensors released today sense red, green, blue, clear, and IR light by incorporating photodiodes, amplifiers, and analog / digital circuits … Read More → "Vishay Intertechnology Launches Integrated RGBC-IR Color Sensors With I²C Interface in Low Profile Packages"

Diamond Introduces STEVIE™ Carrier Board for NVIDIA® Jetson™ AGX Xavier Modules

January 28, 2020

Sunnyvale, California — January 27, 2019 — Diamond Systems, a leading global provider for rugged, I/O-rich embedded computing solutions, has introduced STEVIE, a carrier board solution built to deliver AI-at-the-edge high performance computing based on NVIDIA® Jetson™ AGX Xavier™ modules. Packed with I/O and expandability, STEVIE targets a range of AI, machine learning, image processing and other compute-intensive tasks.  

STEVIE offers a combination of latching and commercial connectors for flexibility and convenience. The front edge features industry-standard connectors for dual Ethernet, dual USB, HDMI, and power input. This enables the creation of … Read More → "Diamond Introduces STEVIE™ Carrier Board for NVIDIA® Jetson™ AGX Xavier Modules"

New Performance Mission Computing Systems Improve Processing Capabilities in Rugged, Space-constrained Applications

Modular configurations provide performance levels that meet edge computing needs
January 28, 2020
Technical Highlights
  • Cisco-certified secure mobile IP routing for reliable computing at-the-edge
  • SWaP-optimized, rugged systems for harsh and remote environments
  • High capacity storage and numerous I/O expansion options
  • Easily configurable Type 6-based design: COM Express and Mini PCIe 

FREMONT, Calif., January 2020 – Elma Electronic Inc. has expanded its line of Read More → "New Performance Mission Computing Systems Improve Processing Capabilities in Rugged, Space-constrained Applications"

Industry’s lowest-power NVRAM available from RS Components

Fast F-RAMs offer no-delay data write, long lifetime and high capacity for portable, industrial and automotive applications
January 28, 2020

LONDON, UK, 28 January 2020 – RS Components (RS) (https://uk.rs-online.com/web/), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has launched the new ExcelonTM range of advanced ferroelectric RAM (F-RAM) devices from Cypress Semiconductor. The most energy efficient non-volatile memory on the market, Excelon offers fast write speeds with no … Read More → "Industry’s lowest-power NVRAM available from RS Components"

Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec’s Riviera-PRO for HDL Simulation

January 28, 2020

Henderson NV, USA – January 28, 2020 – Aldec, Inc., a pioneer in mixed-HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, today announced that Cobham Gaisler has successfully verified its first RISC-V line of processors, called NOEL-V™, using Riviera-PRO™ for mixed-HDL simulation.

NOEL-V is a synthesizable VHDL model of a 64-bit processor that implements the RISC-V architecture, with an advanced 7-stage dual-issue in-order pipeline and provides up to 4.69 CoreMark/MHz. “As a leading vendor of space-grade microprocessors, we needed to verify NOEL-V using a reliable and high-performance RTL simulator with advanced debugging and … Read More → "Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec’s Riviera-PRO for HDL Simulation"

Pentek Announces New Quartz RFSoC Board Aligned with the Technical Standard for the SOSA Reference Architecture

January 28, 2020
  • Pentek Quartz Architecture with Xilinx Zynq UltraScale+ RFSoC FPGA
    3U VPX with PCIe Gen 3
  • Navigator Design Suite for Streamlined IP and Software Development
  • Designed for Communications, Electro-optical, Electronic Warfare Radar and Signals Intelligence Applications

    ATLANTA, GA, Embedded Tech Trends–January 27, 2020–Pentek, Inc., today introduced the Quartz™ Model 5550, an eight-channel A/D and D/A converter, 3U OpenVPX board based on the Xilinx Zynq UltraScale+ RFSoC and aligned to the SOSA™ Technical Standard. The Model 5550 is ideal for many communications, electro-optical, electronic warfare, radar and signals intelligence applications.

    “The Model 5550 is … Read More → "Pentek Announces New Quartz RFSoC Board Aligned with the Technical Standard for the SOSA Reference Architecture"

New standard allows stacked dies in 3D integrated circuits to connect with test equipment

An imec-initiated industry collaboration leads to publication of IEEE Std 1838TM for test access architectures for 3D integrated circuits (3D-ICs)
January 27, 2020

LEUVEN (Belgium), January 27, 2020 — This week, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announces that IEEE Std 1838TM-2019 – recently approved by the IEEE Standards Association – will be included in IEEE Xplore Digital Library from February 2020 onward. The new standard allows die makers to design dies which, if compliant to this standard, constitute, once stacked in a 3D-IC by a stack integrator, a consistent stack-level test access architecture. The standardization effort of the 3D-DfT (design-for-test) was initiated by imec.</ … Read More → "New standard allows stacked dies in 3D integrated circuits to connect with test equipment"

Neonode Expands Its Touch Sensor Offering

January 27, 2020

STOCKHOLM, SWEDEN, January 27, 2020 — Neonode Inc. (NASDAQ: NEON), the optical interactive sensing technology company, is pleased to announce it is expanding its line of touch sensors.

Neonode has established its line of sensor modules as the go-to component for adding touch input, on any surface and in-air, to new and existing products. This new type of touch sensor is intended to be mounted on the side of the touch surface – enabling new levels of design freedom and allowing for integration in a wider range of applications.

The new touch sensors are available at < … Read More → "Neonode Expands Its Touch Sensor Offering"

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