News – Page 878 – EEJournal

Rugged Blade Processor with Dual Xeon Cascade Lake-SP

February 11, 2020

Henderson, NV – February 4, 2020 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the ATC128. The ATC128 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory … Read More → "Rugged Blade Processor with Dual Xeon Cascade Lake-SP"

Matrox to Develop Embedded Graphics Cards with NVIDIA, Solutions Purpose-Built for Next-Generation Video Walls

Matrox to leverage industry-renowned NVIDIA Quadro embedded GPU architecture to enable the development of best-in-class graphics cards

February 10, 2020

MONTREAL – January 22, 2020 – Matrox® today announced a collaboration with NVIDIA for the development of a new range of multi-display embedded graphics cards purpose-built for high-density video walls. Leveraging NVIDIA’s industry-renowned GPU technology, Matrox will design graphics innovations powered by a custom-built Quadro® embedded GPU to accelerate graphics-intensive video wall applications in commercial and 24/7 critical environments.

“Matrox is thrilled to work alongside NVIDIA, the leader in GPU computing, to bring to market a new standard of high-density video walls,” said David Chiappini, executive vice president of research … Read More → "Matrox to Develop Embedded Graphics Cards with NVIDIA, Solutions Purpose-Built for Next-Generation Video Walls"

MagnaChip Offers 0.13 micron BCD Process with Enhanced Performance Suitable for Automotive Power Semiconductors

February 10, 2020

SEOUL, South Korea and SAN JOSE, Calif., February 10, 2020 — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a 0.13 micron BCD process with improved performance to help automotive power semiconductor designers build more competitive products.

BCD (Bipolar-CMOS-DMOS) is a process technology that combines three different process technologies onto a single chip: Bipolar for analog signal control and CMOS (Complementary Metal Oxide Semiconductor) and DMOS (Double Diffused Metal Oxide Semiconductor) for digital signal control and high-power handling, used primarily for power … Read More → "MagnaChip Offers 0.13 micron BCD Process with Enhanced Performance Suitable for Automotive Power Semiconductors"

Vishay Intertechnology -30 V P-Channel MOSFET in PowerPAK® 1212-8S Package Offers Industry-Low RDS(ON) to Increase Power Density, Save Energy in Portable Electronics

Device Offers Industry-Low RDS(ON) of 3.5 mΩ and FOM of 172 mΩ*nC in 10.89 mm² Package

February 10, 2020

MALVERN, Pa. — Feb. 10, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) ) today introduced a new -30 V p-channel TrenchFET® Gen IV power MOSFET that offers industry-low on-resistance of 3.5 mΩ at 10 V in the 3.3 mm by 3.3 mm thermally enhanced PowerPAK® 1212-8S package, in addition to best in class on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 172 mΩ*nC. Purpose-built to increase power density, the space-saving Vishay Siliconix SiSS05DN is 65 % smaller than devices with similar on-resistance in 6 mm by 5 mm packages.

The on-resistance of the MOSFET released today is 26 % lower than … Read More → "Vishay Intertechnology -30 V P-Channel MOSFET in PowerPAK® 1212-8S Package Offers Industry-Low RDS(ON) to Increase Power Density, Save Energy in Portable Electronics"

Bourns Further Expands its SinglFuse™ Line with Five New Automotive-Grade SMD Fuse Model Families

New SinglFuse™ Models are AEC-Q200 Compliant* Making Them Ideal Protection Solutions for Applications that Require Rugged Performance and Superior Reliability

February 10, 2020

RIVERSIDE, Calif., February 10, 2020 – Bourns, Inc., a leading manufacturer and supplier of electronic components, today further expanded the company’s SinglFuse™ product line with new … Read More → "Bourns Further Expands its SinglFuse™ Line with Five New Automotive-Grade SMD Fuse Model Families"

Saelig Introduces Next Generation Aim-TTi 1.5/3GHz RF Signal Generators

The TGR2051/2053 RF signal sources provide exceptional performance with touch-screen operation for improved functionality to support research and development, test and service applications

February 10, 2020

Fairport, NY, USA: Saelig Company, Inc. announces the availability of the AIM-TTi TGR2051 and TGR2053 RF Signal Generators, a major revision of their successful TGR 2000 series, which both offer exceptional performance, very low phase noise, and flexible functionality, offering output signals from 150kHz to 1.5 and 3GHz respectively. These versatile RF generators provide excellent frequency accuracy and stability, large signal amplitude range, low phase noise and extensive analog and digital modulation capabilities. Output power levels from -127dBm to +13dBm are available with 50VDC reverse voltage protection.

Both models feature a simple, user friendly, touch-operated GUI, with … Read More →

MOSFET Driver for Synchronous Rectification from Diodes Incorporated Supports CCM, DCM, and QR Operation

February 7, 2020

Plano, Texas February 6, 2020 Diodes Incorporated (Nasdaq: DIOD) today announced the introduction of the APR348 secondary-side, multi-mode synchronous rectification MOSFET driver, designed for AC-DC rectification circuits in general consumer applications, notebooks, and USB adapters.

The APR348 is capable of driving the external MOSFET in both high-side and low-side secondary-side synchronous-rectifier configurations. This flexible and efficient … Read More →

ETG provides new educational tool for developers

February 5, 2020

The EtherCAT Technology Group (ETG) offers manufacturers, developers and users comprehensive support services for EtherCAT technology. The EtherCAT Device Protocol Poster is an additional tool that specifically helps developers of EtherCAT devices successfully navigate the EtherCAT world.

The poster deals with the basics of EtherCAT technology, the EtherCAT Device Protocol (EDP), and provides a visual overview of EtherCAT. It describes the basic functional principles of EtherCAT, the structure of the frame and its processing in the EtherCAT Slave Controller (ESC). Additionally, it provides further information on the registers used by the ESC, the … Read More → "ETG provides new educational tool for developers"

STMicroelectronics Accelerates Innovation in Automotive Electronics with Powerful Development Tools

February 5, 2020

AutoDevKit™ ecosystem simplifies prototyping state-of-the-art automotive Electronic Control Units
Easily connects robust SPC5 microcontrollers with boards with automotive devices
Free to download, easy to use, application-programming software and source code provided

Geneva, February 5, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is helping the automotive industry deliver safer, greener, and smarter vehicles to market more quickly and cost effectively with new tools that assist the development of electronic control units (ECUs), the ‘mini-computers’ that manage the numerous electronic systems in … Read More → "STMicroelectronics Accelerates Innovation in Automotive Electronics with Powerful Development Tools"

Secure Thingz achieves industry’s first SESIP certification for its Secure Boot Manager

The certification is the first trustworthy assessment for a software component, or development tool, enabling developers to rapidly deploy security into IoT products

February 5, 2020

Cambridge, UK—February 5, 2020—Secure Thingz, a global domain expert in device security, embedded systems and lifecycle management, is proud to announce that its Secure Boot Manager has been assessed and certified according to the Security Evaluation Standard for IoT Platforms (SESIP). The assessment has been conducted by the independent security lab, Brightsight, which is fully licensed by TrustCB, a commercial Certification Body specializing in certifying IoT security products.

SESIP defines a standard for independent certification of the security of IoT devices. End users can rely on devices’ independently audited security claims, while device developers can cost-effectively … Read More → "Secure Thingz achieves industry’s first SESIP certification for its Secure Boot Manager"

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