Cambridge, UK, 12 May 2020:
Agile Analog, a leading provider of semiconductor analog IP, today announced Palma Ceia SemiDesign, a provider of communication chips and IP for WiFi HaLow and Cellular NB-IoT applications, has selected Agile Analog’s data converter and power management IP … Read More → "Configurable Analog Semiconductor IP Enables Faster IoT Chip Design"
Tessenderlo and Leuven, Belgium – May 7, 2020
X-FAB, along with technology partner EUROPRACTICE, today announced the winning project in their competition to encourage further MEMS-based innovation. The triumphant project, entitled “Capacitive MEMS Sensors for High-Resolution Interactive Vibrotactile Displays”, was submitted by a team of engineers from the University of Bath. Entrants from the University of Malta and Delft University of Technology (DUT) came second and third respectively. As a reward, the University of Bath project will now be included in a multi-project wafer (MPW) run that utilizes X-FAB’s XMB10 MEMS process (which is highly optimized for multi-axis sensor … Read More → "X-FAB and EUROPRACTICE Choose Innovative Solution to Help the Visually Impaired as 2020 MEMS Design Contest Winner"
Nijmegen, May 7, 2020: Nexperia, the expert in essential semiconductors, has launched industry’s first family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are an ideal replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels. The new products are available in 30 V – 60 V, with RDS(on) down to 10 mΩ (30 V)
Read More → "Nexperia launches P-channel MOSFETs in robust, space-saving LFPAK56 package"
Taipei, Taiwan – May 11, 2020 – EFCO, a world-class supplier of industrial PC, Gaming and EMS solutions, announced that it has expanded the company’s rugged Eagle Eyes Embedded Vision System with a new DIN Rail series specifically designed for factory automation applications. It comes with high-end, AIHD, and middle-end, AIMD version. Both versions are built rugged, and all of them support extended temperature from -25 to 70 degree.
“This DIN rail series make our Eagle Eyes embedded vision computers easy to install, access and maintain,” stated Bryan Lin, General Manager of EFCO. “The fanless design of … Read More → "EFCO’s Eagle Eyes Embedded Vision Systems Now Available in DIN Rail Series For Factory Automation Applications"
TOKYO, Japan, May 5, 2020 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new precision temperature sensor, the TS5111, targeting DDR5 memory modules as well as a host of other applications such as solid-state disks (SSDs), computing motherboards, and communications equipment that require accurate, real-time temperature monitoring. The new JEDEC-compliant temperature sensor enables memory modules and other temperature-sensitive systems to run at peak efficiency and reliability with real-time, closed-loop thermal management algorithms.
The TS5111 plays a critical role in providing accurate, high-precision system temperatures with programmable warning flags that … Read More → "Renesas Introduces JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Modules"
Flex Power Modules has extended its range of miniature isolated DC/DC converters aimed at industrial applications with the introduction of the PUB-2B series. Available in single or dual output options, the high-performance unregulated modules provide an output power of up to 2 W with no minimum load required.
Housed in a compact SIP7 package measuring 19.7 x 7.1 x 10.2 mm (0.78 x 0.28 x 0.4 in), the devices achieve a high efficiency, typically up to 86% with a 12 V output under full load conditions. Isolation between input and output is rated at 4000 V.
The new family of isolated, unregulated DC/ … Read More → "Flex Power Modules adds 2W DC/DC converter to further boost industrial range"
News Highlights
• Wireless microcontrollers integrate multiprotocol mesh networking
• Integrated NFC NTAG for tap-to-pair installations
• New solutions provide IoT connectivity with ultra-low power performance for connected applications to maximize battery life
• Part of a complete Internet of Things wireless portfolio that includes Bluetooth LE, Thread, Zigbee and WI-FI communications
Eindhoven, Netherlands, May 7, 2020 – NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the K32W061/41 (Read More → "NXP Delivers Ultra-Low Power, Wireless Connectivity for Eco-Friendly Smart Home Devices"
St. Louis and Chennai (May 06, 2020): e-con Systems Inc., a leading embedded camera solution company, today announced the launch of See3CAM_20CUG, 2 MP Monochrome global shutter USB 3.1 Gen1 superspeed Camera. It is based on OmniVision’s OV2311 image sensor with 3 µm x 3 µm pixel with OmniPixel®3-GS technology. It has S-mount (M12) lens holder which allows customers to choose and use … Read More → "e-con Systems launches 2MP Monochrome global shutter USB camera"
GRENOBLE, France – May 7, 2020 – As countries around the world begin rolling out 5G wireless networks, CEA-Leti is looking ahead to sixth-generation technologies that will surpass the data-transfer capability of 5G.
Wireless communication in millimeter wave (mmWave) bands, which range from 20 GHz to 300 GHz, is expected to be a key enabling technology for 6G wireless systems, because the huge available bandwidth can accommodate ultra-high data-rate communications. Within that range of mmWave bands CEA-Leti’s research is investigating D-band, a new spectrum at 140 GHz that may play a major role for 6G wireless communication.
