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Codasip Extends SwerV Support package to Include Western Digital SWERV EH2 & EL2 RISC-v cores

June 4, 2020

Munich, Germany – June 2nd, 2020 – Codasip GmbH, the leading supplier of configurable RISC-V® embedded processor IP, announced today that the Codasip SweRV Support Package has been extended to include the open source, RISC-V-based SweRV Core™ EH2 and EL2 that were contributed to CHIPS Alliance by Western Digital. These have been added to the support already released for the SweRV Core EH1.

The SweRV cores EH2 and EL2 are available to the open-source community through CHIPS Alliance [http://www.chipsalliance.org], an open-source development organization which seeks to provide a barrier-free environment … Read More → "Codasip Extends SwerV Support package to Include Western Digital SWERV EH2 & EL2 RISC-v cores"

IAR Systems and GigaDevice collaborate to bring powerful RISC-V solutions to the market

Establish partnership to provide easy-to-use, complete solutions that enables developers to get started quickly
June 4, 2020

Uppsala, Sweden—June 2, 2020—IAR Systems®, the future-proof supplier of software tools and services for embedded development, and GigaDevice Semiconductor Inc., the popular Flash memory and MCU provider, announce that they have formed a partnership in order to deliver powerful development tools for GigaDevice’s RISC-V based microcontrollers (MCUs).

IAR Systems provides the C/C++ compiler and debugger toolchain IAR Embedded Workbench®. The toolchain offers leading code performance for size and speed, as well as extensive debugging functionality with a fully integrated debugger including simulator and hardware … Read More → "IAR Systems and GigaDevice collaborate to bring powerful RISC-V solutions to the market"

NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services

June 4, 2020

Service providers and end users can benefit from convenient and reliable contactless access and payment solutions
• Enhanced feature set increases security for smart city installations
• Mobile and multi-application support allow service providers to collaborate in new ways and scale their services
• NXP enables fast, robust and secure contactless transactions that are a necessity in today’s environment of social distancing

Eindhoven, Netherlands – June 2, 2020 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era … Read More → "NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services"

UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3

Combines cycle-zero access, 10Gbps data rates, USB3, USB2 and eUSB compatibility
June 4, 2020

CAMBRIDGE, UK – 2 June 2020 UltraSoC today announced a new USB solution which enables SoC and system development teams to access powerful system-level analytics, optimization and debug capabilities at speeds of 10Gbps – even in a closed chassis. UltraSoC’s USB 2.0 IP is based on a patented hardware-based bare-metal technology that requires no software running to establish communication. When combined with high speed USB 3.1 IP from Synopsys, it allows … Read More → "UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3"

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology

Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical
June 3, 2020

Fort Lauderdale, Fla., June 2, 2020 – KEMET Corporation (“KEMET” or the “Company”) (NYSE: KEM) a leading global supplier of electronic components, continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing … Read More → "KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology"

Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies

Companies collaborate to accelerate mobile and hyperscale electronics innovation
June 3, 2020

Highlights:
• Cadence digital, signoff, and custom/analog tools achieve latest DRM and SPICE certification for TSMC N6 and N5 process technologies
• Cadence integrated digital full flow features enhanced physical optimization and timing signoff closure that’s certified for TSMC’s strategic HPC and mobile platforms

SAN JOSE, Calif., June 2, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital full flow and custom/analog tool suites have been further enhanced to deliver optimal results on TSMC’s N6 and N5 process technologies. The Cadence® tool suites have achieved Design Rule Manual (DRM) and SPICE … Read More → "Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies"

Bluetooth SIG and DiiA Collaborate to Accelerate IoT-enabled Commercial Lighting

Organizations to specify standardized Bluetooth mesh interface for DALI lighting devices.
June 3, 2020

KIRKLAND, Wash. & PISCATAWAY, N.J. — The Bluetooth Special Interest Group (SIG), the trade association that oversees Bluetooth® technology, and the DiiA, the global DALI alliance of companies from the lighting and sensor industries, announced today a collaboration designed to accelerate the adoption of IoT-enabled commercial lighting systems.

The collaboration will enable the deployment of certified DALI-2 devices and intelligent D4i luminaires, with qualified Bluetooth mesh intelligent lighting-control networks. This collaboration brings together two leading and complementary IoT standards for commercial lighting.

“Combining Bluetooth mesh with DALI is a natural choice for the commercial … Read More → "Bluetooth SIG and DiiA Collaborate to Accelerate IoT-enabled Commercial Lighting"

Newark Adds New Range of Innovative Power Solutions from MPS

The ground-breaking selection of compact, energy efficient and easy-to-use power solutions by Monolithic Power Systems (MPS) can help accelerate design and bring products to market faster.
June 3, 2020

Chicago – June 2, 2020: Newark, the Development Distributor, has enhanced its semiconductor portfolio with a new range of compact, highly energy efficient power, motion control, and sensor solutions by Monolithic Power Systems (MPS). Since the company was established in 1997, MPS has patented many ground-breaking technologies, including its most notable achievement of integrating an entire power system onto a single chip, which continues to drive their highly integrated systems today. Its … Read More → "Newark Adds New Range of Innovative Power Solutions from MPS"

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