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Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator

Düsseldorf, June 9, 2020  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator. The first product in the series, the RZ/V2M, is designed to deliver a … Read More → "Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator"

TE Connectivity expands LEAVYSEAL connectors product line

WINSTON-SALEM, N.C. – June 9, 2020 – As electrical systems advance in vehicles within the transportation, construction, mining, marine and agricultural industries, so does the need to protect those systems from harsh environments such as vibration, moisture, salt, dust and dirt. To address this growing demand, TE Connectivity (TE), a world leader in connectivity and sensors, has expanded its LEAVYSEAL product line. Read More → "TE Connectivity expands LEAVYSEAL connectors product line"

Introducing High Density Internal Ac-Dc Power Supplies for Medical & Dental Applications

TUALATIN, Ore. — June 9, 2020

CUI Inc today announced the addition of four high-density ac-dc power supply series to its medical product family. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF offer 450 W of continuous power from compact chassis mount packages. These ac-dc supplies have been designed for space-constrained medical and dental applications where reliability and regulatory compliance are major concerns.

The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF comply with the medical 60601-1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements. These internal medical power supplies additionally offer 5 … Read More → "Introducing High Density Internal Ac-Dc Power Supplies for Medical & Dental Applications"

Research: How the electronics industry is responding to COVID-19

Embedded design consultancy ByteSnap Design has revealed the top concerns and priorities for UK electronics companies in its new report: Navigating COVID-19: The New Normal.</ … Read More → "Research: How the electronics industry is responding to COVID-19"

Microchip Introduces 3 kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection in Harsh Environments

CHANDLER, Ariz., June 09, 2020 (GLOBE NEWSWIRE) — To ensure critical operations, aviation and space systems rely on digital and logic functionality and circuitry in engine control units, environmental controls, instruments and actuators. Data centers, the 5G infrastructure and communication systems also rely on complex circuitry requiring protection. Each system must operate continuously despite voltage surges and spikes from lightning, solar events and electromagnetic incidents. Microchip Technology Inc. (Nasdaq: MCHP) today announced its newly-expanded portfolio of Transient Voltage Suppressor (TVS) vertical arrays – the Read More → "Microchip Introduces 3 kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection in Harsh Environments"

ADLINK Teams with Intel to Launch ROScube-I ROS 2 Controller to Realize AI Robotics at the Edge

SAN JOSE, June 9, 2020 — ADLINK Technology, a global leader in edge computing, has launched the ROScube-I with Intel, providing a real-time ROS 2 robot controller for advanced robotic applications. The ADLINK ROScube-I Series is a ROS 2-enabled robotic controller based on Intel® Xeon® E, 9th Gen Intel® CoreTM i7/i3 and 8th Gen Intel® CoreTM i5 processors, and features exceptional I/O connectivity supporting a wide variety of sensors and actuators to meet the needs of a wide range of robotic applications. The ROScube-I supports … Read More → "ADLINK Teams with Intel to Launch ROScube-I ROS 2 Controller to Realize AI Robotics at the Edge"

SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols

SAN JOSE, CALIF. –– June 4, 2020 –– SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today delivered a series of video, imaging and entertainment system Design IP compliant with a variety of standard protocol specifications.

The new Design IP is available for:

Mentor joins the O-RAN ALLIANCE to help drive interoperability requirements for 5G network silicon

  • Mentor, a Siemens business, will help the O-RAN ALLIANCE verify and validate 5G mobile network systems — from processor design to end-system production and testing.
  • With a complete pre- and post-silicon verification and validation solution, Mentor solves complex challenges of network interoperability testing.

As the worldwide buildout of public 5G wireless networks continues, and interest grows in private 5G wireless networks, the pace of deployment and full operation of these networks is increasingly dependent on successful interoperability across multiple vendors. Unlike the pre-5G era, 5G wireless networks … Read More → "Mentor joins the O-RAN ALLIANCE to help drive interoperability requirements for 5G network silicon"

RS Components expands support to frontline health workers around the world with 3D-printed PPE

LONDON, UK, 8 June 2020 – RS Components, the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, is broadening its focus to help frontline healthcare workers around the world access 3D-printed personal protection equipment (PPE). The company’s DesignSpark engineering community has been very active in supporting the National 3D Printing Society’ … Read More → "RS Components expands support to frontline health workers around the world with 3D-printed PPE"

STMicroelectronics Joins the Silicon Catalyst Ecosystem

Silicon Valley, California, and Geneva, Switzerland, June 8, 2020 – Silicon Catalyst, the world’s only incubator focused exclusively on accelerating solutions in silicon, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, jointly announce that ST has joined Silicon Catalyst as both a Strategic and In-Kind Partner. As a Strategic Partner, the collaboration provides STMicroelectronics with early access to review and help select the early-stage silicon start-ups seeking to participate in the Silicon Catalyst Incubator. The initial focus of the In-Kind collaboration will be MEMS sensors and actuators.
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